Stretchable circuit substrate and article

ABSTRACT

The present disclosure provides a stretchable circuit substrate comprising: a base material being stretchable; a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface of the base material; and an adjustment layer which includes the bellows-like member and is on the first surface side of the base material so as to at least overlap, in a plan view, a wiring region in which the wiring is positioned; wherein the adjustment layer has a Young&#39;s modulus smaller than a Young&#39;s modulus of the wiring.

TECHNICAL FIELD

This application is a continuation of U.S. application Ser. No.16/761,155 filed May 1, 2020, which is a national stage application ofPCT/JP2018/038090 filed Oct. 12, 2018. This application also claimspriority to Japanese Patent Application No. 2017-215039 filed Nov. 7,2017. The present disclosure is related to a stretchable circuitsubstrate including stretchable substrate and wiring.

BACKGROUND ART

In recent years, stretchable electronics have been attracted attentionsand the development of a stretchable circuit substrate capable of beingstretched has been actively advanced. As one of the methods forobtaining the stretchable circuit substrate, Patent Document 1 suggestsa method in which a base material being stretchable is expanded inadvance, a metal thin film is disposed on the base material that is inthe state being expanded, and then the base material is relaxed.

CITATION LISTS

Patent Document 1: Japanese Patent Application Laid-Open (JP-A) No.2007-281406

Non-Patent Documents

Non-Patent Document 1: Seungjun Chung et al., “Inkjet-printedstretchable silver electrode on wave structured elastomeric substrate”,Appl. Phys. Lett. 98, 153110 (2011)

Non-Patent Document 2: Jaemyon Lee et al., “Lateral-crack-free, buckled,inkjet-printed silver electrodes on highly pre-stretched elastomericsubstrates”, Appl. Phys. 46 (2013) 105305

Non-Patent Document 3: Junghwan Byun et al., “Fully printable,strain-engineered electronic wrap for customizable soft electronics”,Scientific Reports 7:45328, 24 Mar. 2017

Non-Patent Document 4: Martin Kaltenbrunner et al., “Anultra-lightweight design for imperceptible plastic electronics”, Nature,July 2013

Non-Patent Document 5: Tomoyuki Yokota et al., “Ultraflexible organicphotonic skin”, Sci. Adv. 2016; 2: e1501856 15 Apr. 2016

SUMMARY Technical Problem

In the above described production method of the stretchable circuitsubstrate, when the base material shrinks as it is relaxed, the metalthin film changes its form to bellows-like shape to have a bellows-likemember in which ridges and recesses continuously appear along thein-plane direction of the base material. The thin metal film includingthe bellow-like member can follow expansion of the base material byexpanding the bellow-like member to the in-plain direction when the basematerial is expanded. For that reason, in such a stretchable circuitsubstrate, change in the resistance value of the metal thin film alongwith the stretch of the base material can be inhibited.

Meanwhile, in the above described production method of the stretchablecircuit substrate, the degree of changes of the form of the thin metalfilm when it changes to bellows-like shape may vary on positions due todifference of extension of the base material when it is expanded anddifference of distribution density of the thin metal film on the basematerial. When the degree of change in forms of the metal thin film isuneven, there are some cases where the extent of curves and bends of themetal thin film locally increases. On the spot where the extent of thecurves and the bends appear in the metal thin film is locally large,stress concentrates to generate fractures such as bent, and theresistance value may increase when the stretchable circuit substrate isrepeatedly stretched as well.

The present disclosure has been made in view of the above problem, andan object of the present disclosure is to provide a stretchable circuitsubstrate in which the fracture such as bent of a wiring and theincrease in the resistance value of the wiring can be inhibited.

Solution to Problem

In order to achieve the object, the present disclosure provides astretchable circuit substrate comprising: a base material beingstretchable; a wiring which is on a first surface side of the basematerial, and which includes a bellows-like member including a pluralityof ridges and recesses arranged in a first direction which is one ofin-plane directions in the first surface of the base material; and anadjustment layer which includes the bellows-like member and is on thefirst surface side of the base material so as to at least overlap, in aplan view, with a wiring region in which the wiring is positioned;wherein the adjustment layer has a Young's modulus smaller than aYoung's modulus of the wiring.

The present disclosure also provides a stretchable circuit substratecomprising: a base material being stretchable; a wiring which is on afirst surface side of the base material, and which includes abellows-like member including a plurality of ridges and recessesarranged in a first direction which is one of in-plane directions in thefirst surface of the base material; and an adjustment layer whichincludes the bellows-like member and is on the first surface side of thebase material so as to at least overlap, in a plan view, a wiring regionin which the wiring is positioned; wherein the adjustment layer has aYoung's modulus larger than a Young's modulus of the base material.

The present disclosure also provides an article comprising the abovedescribed stretchable circuit substrate.

Advantageous Effects

The fracture such as bent of a wiring and the increase in the resistancevalue of the wiring can be inhibited by the present disclosure.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A and 1B are a schematic plan view and a cross-sectional viewillustrating an example of the stretchable circuit substrate of thepresent disclosure.

FIGS. 2A to 2D are schematic cross-sectional views illustrating anadditional example of the stretchable circuit substrate of the presentdisclosure.

FIGS. 3A to 3D are schematic cross-sectional views illustrating anadditional example of the stretchable circuit substrate of the presentdisclosure.

FIG. 4 is a schematic cross-sectional view illustrating an additionalexample of the stretchable circuit substrate of the present disclosure.

FIGS. 5A and 5B are schematic cross-sectional views illustrating anadditional example of the stretchable circuit substrate of the presentdisclosure.

FIG. 6 is a schematic diagram illustrating an example of thebellows-like member of the wiring in the stretchable circuit substrateof the present disclosure.

FIGS. 7A and 7B are schematic cross-sectional views illustrating anadditional example of the stretchable circuit substrate of the presentdisclosure.

FIG. 8 is a schematic cross-sectional view illustrating an additionalexample of the stretchable circuit substrate of the present disclosure.

FIGS. 9A and 9B are schematic plan view illustrating an example of thewiring in the stretchable circuit substrate of the present disclosure.

FIGS. 10A and 10B are a schematic plan view and a cross-sectional viewillustrating an example of the stretchable circuit substrate.

FIG. 11 is a schematic cross-sectional view illustrating an additionalexample of the stretchable circuit substrate of the present disclosure.

FIGS. 12A and 12B are schematic cross-sectional views illustrating anadditional example of the stretchable circuit substrate of the presentdisclosure.

FIGS. 13A to 13D are schematic cross-sectional views illustrating anadditional example of the stretchable circuit substrate of the presentdisclosure. FIGS. 14A to 14E are schematic cross-sectional viewsillustrating an additional example of the stretchable circuit substrateof the present disclosure.

FIGS. 15A and 15B are schematic cross-sectional views illustrating anadditional example of the stretchable circuit substrate of the presentdisclosure.

FIGS. 16A to 16C are schematic plan views illustrating an additionalexample of the stretchable circuit substrate of the present disclosure.

FIGS. 17A and 17B are schematic cross-sectional views illustrating anadditional example of the stretchable circuit substrate of the presentdisclosure.

FIGS. 18A to 18D are schematic cross-sectional views illustrating anadditional example of the stretchable circuit substrate of the presentdisclosure.

FIGS. 19A to 19E are schematic cross-sectional views illustrating anadditional example of the stretchable circuit substrate of the presentdisclosure.

FIGS. 20A and 20B are schematic plan views illustrating an additionalexample of the stretchable circuit substrate of the present disclosure.

FIG. 21 is a schematic cross-sectional view illustrating an additionalexample of the stretchable circuit substrate of the present disclosure.

FIG. 22 is a schematic cross-sectional view illustrating an additionalexample of the stretchable circuit substrate of the present disclosure.

FIGS. 23A to 23C are schematic cross-sectional views illustrating anadditional example of the stretchable circuit substrate of the presentdisclosure.

FIG. 24 is a schematic cross-sectional view illustrating an additionalexample of the stretchable circuit substrate of the present disclosure.

FIGS. 25A to 25E are process diagrams illustrating an example of themethod for producing the stretchable circuit substrate of the presentdisclosure.

FIGS. 26A to 26E are process diagrams illustrating an additional exampleof the method for producing the stretchable circuit substrate of thepresent disclosure.

FIGS. 27A and 27B are process diagrams illustrating an additionalexample of the method for producing the stretchable circuit substrate ofthe present disclosure.

DESCRIPTION OF EMBODIMENTS

The stretchable circuit substrate of the present disclosure will behereinafter described in details. The stretchable circuit substrate ofthe present disclosure has two embodiments. Each of the embodiments willbe hereinafter separately described.

A. First Embodiment

The stretchable circuit substrate in the first embodiment of the presentdisclosure comprises a base material being stretchable; a wiring whichis on a first surface side of the base material, and which includes abellows-like member including a plurality of ridges and recessesarranged in a first direction which is one of in-plane directions in thefirst surface of the base material; and an adjustment layer whichincludes the bellows-like member and is on the first surface side of thebase material so as to at least overlap, in a plan view, a wiring regionin which the wiring is positioned; wherein the adjustment layer has aYoung's modulus smaller than a Young's modulus of the wiring.

“Stretchable” signifies characteristics of being capable of expandingand contracting; in other words, characteristics of being capable ofexpanding from a normal unstretched state and being capable ofrecovering when it is released from the stretched state. The unstretchedstate is a state when a tensile stress is not applied.

The “wiring which is on a first surface side of the base material” meansthat the wiring may be positioned directly on the first surface of thebase material, and the wiring may be in between the first surface sideof the base material and an additional member.

Also, the “adjustment layer which is on the first surface side of thebase material” means that the adjustment layer may be positioneddirectly on the first surface of the base material, and the adjustmentlayer may be in between first surface side of the base material and anadditional member.

An explanation of a position of the member which is on the first surfaceside of the base material may be the same as the explanation of theposition of the wiring which is on the first surface side of the basematerial, and the explanation of the position of the adjustment layerwhich is on the first surface side of the base material.

The stretchable circuit substrate of the present embodiment will bedescribed with reference to drawings. In the drawings referred in thepresent disclosure, the same part or the part having the same functionis designated the same reference numerical or a similar referencenumerical, and repeated explanations thereof may be omitted in somecases.

FIG. 1A is a schematic plan view and FIG. 1B is a cross-sectional viewillustrating an example of the stretchable circuit substrate of thepresent embodiment, and FIG. 1B is a cross-sectional view in A to A lineof FIG. 1A. Stretchable circuit substrate 1 illustrated in FIGS. 1A and1B comprises base material 2 being stretchable, wiring 4 which is onfirst surface 2 a side of the base material 2, and adjustment layer 3which is on the first surface 2 a side of the base material 2 and inwiring region 21 in which the wiring 4 is positioned, and has a Young'smodulus smaller than a Young's modulus of the wiring 4. In FIGS. 1A and1B, the adjustment layer 3 is positioned between the base material 2 andthe wiring 4. Incidentally, the adjustment layer 3 may be on the surfaceof the wiring 4 which is opposite side surface to the base material 2side surface. In FIGS. 1A and 1B, the adjustment layer 3 is positionedon the entire surface of the first surface 2 a side of the base material2. The adjustment layer 3 is positioned at the wiring region 21 as wellas at functional member region 22 that is adjacent to the wiring region21 and to which functional member 5 is mounted. The adjustment layer 3may be positioned in the place at least of the wiring region 21. Also,the stretchable circuit substrate 1 may comprise the functional member 5on the first surface 2 a side of the base material 2.

In the stretchable circuit substrate 1, the wiring 4 and the adjustmentlayer 3 includes bellows-like member 30 in which ridges 31, 33, 33 andrecesses 32, 34, 36 in the normal direction of the first surface 2 a ofthe base material 2 continuously appear along with in-plane direction ofthe first surface 2 a of the base material 2. In FIGS. 1A and 1B, theridge 31 is a ridge that appears at surface of the wiring 4 which isopposite to the surface of the wiring 4 which faces the base material 2,the ridge 33 is a ridge that appears in the surface of the wiring 4which faces the base material 2 and the surface of the adjustment layer3 which is opposite to the surface of the adjustment layer 3 which facesthe base material, and the ridge 35 is a ridge that appears in thesurface of the adjustment layer 3 which faces the base material 2. Also,the recess 32 is a recess that appears at surface of the wiring 4 whichis opposite to the surface of the wiring 4 which faces the base material2, the recess 34 is a recess that appears in the surface of the wiring 4which faces the base material 2, and the surface of the adjustment layer3 which is opposite to the surface of the adjustment layer 3 which facesthe base material 2, and the recess 36 is a recess that appears in thesurface of the adjustment layer 3 which faces the base material 2. Asdescribed later, in the production method of the stretchable circuitsubstrate, when the wiring 4 is disposed on the first surface 2 a sideof the base material 2 which is in the state being expanded in advanced(“on” here includes a case an additional layer is interposedtherebetween; hereinafter the same is true), and when the base material2 is contracted by removing tensile stress from the base material 2, thewiring 4 would change its form to bellows-like shape as shown in FIG. 1Bto have the bellows-like member 30. Likewise, the adjustment layer 3would also have the bellows-like member 30.

Hereinafter, the direction from the ridge toward the recess in thebellows-like member that is the direction in which the ridges and therecesses of the bellows-like member continuously appear may be referredto as a first direction. In FIGS. 1A and 1B, the wiring 4 extendsparallelly to the first direction D1.

In the present disclosure, the wiring includes the bellows-like member.When the stretchable circuit substrate is expanded, the base materialcan be expanded by its elastic modification since the base material isstretchable. If the wiring also expanded similarly by its elasticmodification, the total length of the wiring would increase and thecross-sectional area of the wiring would decrease; as a result, theresistance value of the wiring would increase. Also, there is apossibility that fractures such as a crack in the wiring is caused bythe elastic modification of the wiring. Whereas, in the presentdisclosure, the wiring includes the bellows-like member, and thus thewiring follows the expansion of the base material when the base materialexpands, since the bellows-like member changes its form to reduce theundulation, that is to eliminate the bellows-like shape. Thereby,increase in the total length of the wiring along with the expansion ofthe base material and decrease in the cross-section area of the wiringcan be inhibited. Accordingly, increase in the resistance value of thewiring caused by the expansion of the stretchable circuit substrate canbe inhibited. Also, generation of fractures such as crack in the wiringcan be inhibited.

In the production method of the stretchable circuit substrate, when thewiring changes its form to bellows-like shape, the degree of change inform varies with positions due to the factors such as uneven stretch ofthe base material when it is expanded and difference in distributiondensity of the metal thin film on the base material. When the degree ofchange in forms of the wiring is uneven, there are some cases where theextent of curves and bends appear in the wiring locally increases.Stress concentrates on the spot where the extent of the curves and thebends appear in the wiring is locally large. Also, in general, anelastomer is used for the base material and a material such as a metaland an alloy is used for the wiring; thus, the Young's modulus of thewiring is extremely larger than the Young's modulus of the basematerial. In other words, the wiring is harder and much difficult tochanges its form than the base material. For that reason, stress easilyconcentrates on the spot where the extent of the curves and the bendsappear in the wiring is locally large. On the spot where stressconcentrates in the wiring, fractures such as bent may be generated, andthe resistance value increases when the stretchable circuit substraterepeatedly stretches as well.

Whereas, in the present embodiment, the stress can be dispersed bypositioning an adjustment layer having a Young's modulus smaller thanthat of the wiring, which means it is softer than the wiring and moreeasily changes its form, at the wiring region of the first surface sideof the base material.

Accordingly, even when the extent of curves and bends appear in thewiring are locally large, stress concentration on the spot where theextent of the curves and the bends appear in the wiring is locally largecan be reduced. Thereby, the fracture of the wiring and the increase inthe resistance value of the wiring when the stretchable circuitsubstrate repeatedly stretches can be inhibited.

The stretchable circuit substrate of the present embodiment comprises atleast a base material being stretchable, a wiring, and an adjustmentlayer. Each component of the stretchable circuit substrate in thepresent embodiment will be hereinafter described.

1. Adjustment Layer

The adjustment layer in the present embodiment is a member: typically,positioned on the first surface side of the base material; alsopositioned in the wiring region; includes a bellows-like member in whichridges and recesses in the normal direction of the first surface of thebase material continuously appear along with the in-plane direction ofthe first surface of the base material; and has Young's modulus smallerthan that of the wiring.

The Young's modulus of the adjustment layer is smaller than the Young'smodulus of the wiring. Also, the Young's modulus of the adjustment layeris preferably larger than the Young's modulus of the base material beingstretchable. In other words, it is preferable that the adjustment layerhas a Young's modulus which is in the middle of that of the wiring andthat of the base material. The reason therefor is because stressconcentration can be reduced when the adjustment layer having a Young'smodulus which is in the middle of that of the wiring and that of thebase material, which means it is softer than the wiring and more easilychanges its form as well as harder than the base material and moredifficultly changes its form, is positioned in the wiring region of thefirst surface side of the base material.

Also, as described later, when the stretchable circuit substrate of thepresent embodiment includes a supporting base material between the basematerial and the wiring, the Young's modulus of the adjustment layer maybe smaller than the Young's modulus of the supporting base material, maybe the same as the Young's modulus of the supporting base material, andmay be larger than the Young's modulus of the supporting base material.Among these, the Young's modulus of the adjustment layer is preferablysmaller than the Young's modulus of the supporting base material. Thereason therefor is because stress concentration can be reduced when theadjustment layer having a smaller Young's modulus than that of thewiring and that of the supporting base material, which means it issofter than the wiring and the supporting base material and more easilychanges its form, is positioned in the wiring region of the firstsurface side of the base material.

In specific, the Young's modulus of the adjustment layer may be lessthan 1 time of the Young's modulus of the wiring, and is preferably 0.9times or less, more preferably 0.1 times or less, and further preferably0.05 times or less. Also, the Young's modulus of the adjustment layermay be 0.001 times or more of the Young's modulus of the wiring, and ispreferably 0.01 times or more.

Also, the Young's modulus of the adjustment layer may be more than 1time of the Young's modulus of the base material being stretchable, ispreferably 1.1 times or more, and more preferably 2 times or more. Also,the Young's modulus of the adjustment layer may be 100 times or less ofthe Young's modulus of the base material being stretchable, and ispreferably 10 times or less.

The reason therefor is because it may be difficult to reduce stressconcentration in cases where the Young's modulus of the adjustment layeris too small or too large.

Also, the Young's modulus of the adjustment layer may be, for example, 1GPa or less, is preferably 100 MPa or less, and more preferably 10 MPaor less. Also, the Young's modulus of the adjustment layer may be, forexample, 10 kPa or more, and is preferably 1 MPa or more. The reasontherefor is because it may be difficult to reduce stress concentrationin cases where the Young's modulus of the adjustment layer is too smallor too large.

The Young's modulus of each member is a Young's modulus at a roomtemperature (25° C.)

As a method for measuring the Young's modulus of the adjustment layer, amethod of conducting a tensile test according to JIS K6251 using asample of the adjustment layer may be adopted. Also, as a method ofobtaining the Young's modulus of the adjustment layer, a measurementmethod with a nano-indentation according to ISO14577 may be adopted aswell. In specific, the Young's modulus of the adjustment layer may bemeasured by using a nano-indenter. Examples of the method for preparingthe sample of the adjustment layer may include a method of taking out apart of the adjustment layer from the stretchable circuit substrate as asample, and a method of taking out a part of the adjustment layer as asample prior to constituting the stretchable circuit substrate. Otherthan those, as a method of obtaining the Young's modulus of theadjustment layer, a method of analyzing materials composing theadjustment layer and obtaining the Young's modulus of the adjustmentlayer based on the existing database of the materials may be adopted aswell.

The method of obtaining the Young's modulus of each member such as thewiring, the base material being stretchable, and the supporting basematerial, is the same as the method of obtaining the Young's modulus ofthe adjustment layer. Also, as the method of calculating these Young'smoduluses, an appropriate standard depending on the form of the membermay be used. For example, for the later described stretch controllingpart and supporting base material, a method of conducting a tensile testaccording to ASTM D882 may be adopted.

The adjustment layer includes a bellows-like member. The bellows-likemember may be the same as a bellows-like member included in the wiringdescribed layer.

A material of the adjustment layer is the one having the above describedYoung's modulus, and it may and may not be stretchable. Above all, thematerial of the adjustment layer preferably is stretchable. The reasontherefor is because the adjustment layer may have resistance to changein form when it includes a material being stretchable.

Examples of a material not being stretchable usable in the adjustmentlayer may include a resin. As the resin, general resins may be used; forexample, any of a thermoplastic resin, a thermosetting resin, and aphotocurable resin may be used. Also, when the adjustment layer includesa resin, a resin base material may be usable as the adjustment layer.

The stretchability of the material being stretchable usable in theadjustment layer may be the same as the stretchability of the basematerial being stretchable described later.

Examples of the material being stretchable usable in the adjustmentlayer may include an elastomer. As the elastomer, a generalthermoplastic elastomer and thermosetting elastomer may be used.Specific examples thereof may include a styrene-based elastomer, anolefin-based elastomer, a urethane-based elastomer, an amide-basedelastomer, a silicone rubber, a urethane rubber, a fluorine rubber,polybutadiene, polyisobutylene, polystyrenebutadiene, andpolychloroprene. When the material composing the adjustment layer isthese resins, the adjustment layer may have transparency. Also, theadjustment layer may have characteristics of light shielding such thatshielding ultraviolet ray. For example, the adjustment layer may beblack. The color of the adjustment layer may be the same as the color ofthe base material. The adjustment layer may also have design propertiesto have a decorative function.

Also, when the adjustment layer is in contact with the wiring, itpreferably has insulation. A resin or an elastomer can make theadjustment layer insulative.

The adjustment layer is positioned in at least the wiring region; forexample, it may be positioned in the entire surface of the first surfaceside of the base material, and may be positioned at part of the firstsurface side of the base material.

Among the above, for example, as shown in FIG. 1B and FIGS. 2A to 2C, itis preferable that the adjustment layer 3 is positioned continuously inthe wiring region 21 and the functional member region 22 which isadjacent to the wiring region 21 and to which the functional member 5 ismounted.

In the stretchable circuit substrate, the height of the ridges in thebellows-like member is locally increased in some cases due to factorssuch as uneven thickness of the base material and difference indistribution density of the wiring arranged on the base material. Forexample, a large ridge is generated in the wiring near the borderbetween the wiring and the functional member. In this case, large stresswould be applied to an electronically connected part between the wiringand the functional member and there is a risk the electronicallyconnected part is damaged.

Whereas, wiring generation of the large ridge in the wiring near theborder between the wiring and the functional member can be inhibited ifthe adjustment layer is positioned continuously in the wiring region andthe functional member region. Thereby, the damage of the electronicallyconnected part between the wiring and the functional member can beinhibited. A functional member surrounding region described later may beapprehended as a part of the wiring region.

When the adjustment layer is positioned continuously in the wiringregion and the functional member region, the adjustment layer ispositioned continuously in at least the wiring region and the functionalmember region; for example, the adjustment layer3 may be positioned inthe entire region of the functional member region 22 as illustrated inFIG. 1B and FIG. 2A, and may be positioned at a part of the functionalmember region 22 as illustrated in FIGS. 2B to 2C. When the adjustmentlayer is positioned at apart of the functional member region, forexample, the adjustment layer may, in a plan view, have a shapeincluding an opening where a part of the functional member is exposed.

Also, the adjustment layer 3 may not be positioned in the functionalmember region 22 as illustrated in FIG. 2D; in other words, it may notbe positioned continuously in the wiring region 21 and the functionalmember region 22. In this case, as described later, it is preferablethat the stretchable circuit substrate in the present embodimentcomprises a second stretch controlling part which is positioned ateither the first surface side of the base material, the second surfaceside of the base material, or inside the base material, also positionedin the functional member surrounding region positioned in thesurroundings of the functional member region, and is extended to theborder between the functional member surrounding region and thefunctional member region. In other words, the second stretch controllingpart is, in a plan view, preferably positioned in the border between thefunctional member surrounding region and the functional member region.The reason therefor is because the generation of the large ridge in thewiring near the functional member can be inhibited when the secondstretch controlling part is arranged in the functional membersurrounding region, and also the second stretch controlling part isextended to the border between the functional member surrounding regionand the functional member region. Thereby, the damage of theelectronically connected part between the wiring and the functionalmember can be inhibited. Also, when the wiring includes a terminal partto be connected to the functional member, the adjustment layer may, in aplan view, cover the wiring region entirely excluding the terminal partof the wiring.

The position of the adjustment layer described above is the same for thecase when the stretchable circuit substrate of the present embodimentincludes the supporting base material between the base material and thewiring.

The adjustment layer is positioned on the first surface side of the basematerial; for example, the adjustment layer 3 may be positioned betweenthe base material 2 and the wiring 4 as illustrated in FIG. 1B and FIG.2C, and may be positioned at surface of the wiring 4 which is theopposite surface of the wiring 4 facing the base material 2 asillustrated in FIGS. 2A, 2B, and 2D.

Also, when the stretchable circuit substrate of the present embodimentincludes a supporting base material between the base material and thewiring, for example, the adjustment layer 3 may be positioned betweenthe supporting base material 7 and the wiring 4 as illustrated in FIG.3A, may be positioned at surface of the wiring 4 which is the surfaceopposite to the surface of the wiring 4 facing the supporting basematerial 7 as illustrated in FIGS. 3B and 3D, and may be positionedbetween the base material 2 and the supporting base material 7 asillustrated in FIG. 3C. Also, when the adjustment layer is positionedbetween the base material and the supporting base material, and when thestretchable circuit substrate of the present embodiment includes anadhesive layer between the base material and the supporting basematerial, the adjustment layer 3 may be positioned between the adhesivelayer 6 and the supporting base material 7 as illustrated in FIG. 3C.Also, as illustrated in FIG. 4, the supporting base material 7 may bepositioned at surface of the wiring 4 which is the opposite surface ofthe wiring 4 facing the base material 2.

Above all, the adjustment layer is preferably positioned on the surfaceof the wiring which is the surface opposite to the surface of wiringfacing the base material. The reason therefor is because stressconcentration can be effectively reduced when the adjustment layerhaving a Young's modulus smaller than that of the wiring and larger thanthat of the base material is positioned at the surface of the wiringwhich is the surface opposite to the surface of wiring facing the basematerial. Further, when the adjustment layer is positioned at thesurface of the wiring which is the surface opposite to the surface ofwiring facing the base material, the adjustment layer works as a shapeprotecting layer as well. For example, a pressurizing treatment and aheating and pressurizing treatment may be conducted in some cases duringthe production of the stretchable circuit substrate after producing thebellows-like shape. Even after conducting such a treatment, the casewhere the adjustment layer is positioned at the surface of the wiringwhich is the surface opposite to the surface of wiring facing the basematerial is advantageous such that the shape of the bellows-like memberwould not easily get out of shape.

Also, when the adjustment layer is positioned between the base materialand the wiring, and when the stretchable circuit substrate of thepresent embodiment includes the supporting base material between thebase material and the wiring, the adjustment layer is preferablypositioned between the supporting base material and the wiring. Thereason therefor is because stress concentration can be effectivelyreduced when the adjustment layer having a Young's modulus smaller thanthat of the wiring is positioned on the surface of the wiring facing thebase material.

The stretchable circuit substrate of the present embodiment may comprisejust one layer of the adjustment layer, and may comprise two or morelayers of the adjustment layer. Above all, it is preferable that theadjustment layer is included on the both surface of the wiring, as afirst adjustment layer and a second adjustment layer respectively on onesurface and the other surface of the wiring. When the first adjustmentlayer and the second adjustment layer are positioned respectively on theboth surface of the wiring, it is possible to further disperse thestress which tends to be concentrated at the point where the degree ofcurves and bends generated in the wiring is locally large. For example,in FIG. 5A, first adjustment layer 3α is positioned on one surface ofthe wiring 4, second adjustment layer 3β is positioned on the othersurface of the wiring 4, and the supporting base material 7 is furtherpositioned between the second adjustment layer 3β and the base material2. On the other hand, in FIG. 5B, the first adjustment layer 3α ispositioned on one surface of the wiring 4, the second adjustment layer3β is positioned on the other surface of the wiring 4, and thesupporting base material 7 is further positioned between the wiring 4and the second adjustment layer 3β. The materials of the firstadjustment layer 3α and the second adjustment layer 3β may be the sameand may be different. Also, the thicknesses of the first adjustmentlayer 3α and the second adjustment layer 3β may be the same and may bedifferent.

The adjustment layer usually does not have adhesion. When thestretchable circuit substrate of the present embodiment includes thesupporting base material between the base material and the wiring, anadhesive layer is included in some cases between the base material andthe supporting base material; however, the adjustment layer isdistinguished from such an adhesive layer.

Here, “does not have adhesion” means that the adhesion of the adjustmentlayer is 0.01 N/25 mm or less, and it is preferably 0.005 N/25 mm orless, and more preferably 0.001 N/25 mm or less.

As a method for measuring the adhesion of the adjustment layer, a methodof conducting a 180° peeling test using a sample of the adjustment layercan be adopted. Examples of the method for preparing the sample of theadjustment layer includes a method of taking out a part of theadjustment layer from the stretchable circuit substrate as a sample, anda method of taking out a part of the adjustment layer as a sample priorto constituting the stretchable circuit substrate. As a method formeasuring the adhesion of the adjustment layer, a method of analyzingmaterials composing the adjustment layer and obtaining the adhesion ofthe adjustment layer based on the existing database of the materials canbe adopted. In the 180° peeling test, first, a test piece having 25 mmwidth is taken out, and a glass plate having 25 mm width is attached tothe adjustment layer side surface of the test piece. Next, measure theadhesion (N/25 mm) to the glass plate by using a tensile test machine atthe conditions as follows: tensile speed: 1200 mm/minute, peeling angle:180°, temperature: 20° C., and humidity: 50%.

The thickness of the adjustment layer is a thickness which tolerates thestretch, and may be appropriately selected depending on the factors suchas materials of the adjustment layer. The thickness of the adjustmentlayer is, for example, 0.1 μm or more, is preferably 1 μm or more, andmore preferably 10 μm or more. Also, the thickness of the adjustmentlayer is, for example 1 mm or less, is preferably 500 μm or less, andmore preferably 100 μm or less. If the adjustment layer is too thin, theeffect of reducing stress concentration cannot be sufficiently attainedin some cases. Also, if the adjustment layer is too thick, the bendingrigidity of the adjustment layer would increase even when the Young'smoduluses satisfy the above described relationship, and it is difficultto reduce stress concentration in some cases. The bending rigidity isthe product of the cross-sectional secondary moment of a targeted memberand the elastic coefficient of the material composing the targetedmember, and its unit is N·m² or Pa·m⁴. The cross-sectional secondarymoment of the adjustment layer can be calculated based on across-section of a part of the adjustment layer overlaps with the wiringis cut by a plane orthogonal to the stretch direction of the stretchablecircuit substrate wiring. Also, the thickness of the adjustment layermay be, at least partially, decreased along with the direction from thefunctional member region toward the wiring side region.

A method for arranging the adjustment layer on the first surfaces of thebase material may be appropriately selected depending on factors such asthe materials of the adjustment layer and the layer structure of thestretchable circuit substrate. Examples of the method include a methodof coating a resin composition for the adjustment layer on the firstsurface of the base material, a method of bonding the adjustment layerto the first surface of the base material by interposing the adhesivelayer, a method of thermally laminating the base material and theadjustment layer, and a method of simultaneously molding the basematerial and the adjustment layer.

Hereafter, when the adjustment layer is bonded to the first surface ofthe base material by interposing the adhesive layer, this adhesive layeris referred to as a first adhesive layer in some cases.

There are no particular limitations on the first adhesive layer, andgeneral pressure sensitive adhesives and adhesives usable for circuitsubstrates may be used.

The first adhesive layer usually has a bellows-like member. Thebellows-like member can be the same as the bellow-member included in thewiring as described later.

The thickness of the first adhesive layer is not limited to the extentthe first adhesive layer is stretchable and can be attached to the firstsurface of the base material; for example, it is in a range of 10 μm ormore and 100 μm or less.

The first adhesive layer may be a molecule adhesive layer. “Moleculeadhesive” means to adhesively bond two articles with chemical bonding byapplying a compound to be the molecule adhesive between the two ofarticles. In the present disclosure, the base material and theadjustment layer can be adhesively bonded with chemical bonding usingthe molecule adhesive.

As the molecule adhesive usable in the molecule adhesive layer, knownmolecule adhesives can be used, and it may be appropriately selectedaccording to applications of the stretchable circuit substrate. Examplesthereof include a silane coupling agent and a thiol-based compound.

The thickness of the molecule adhesive layer is, for example, about afew nanometer (nm) to 100 nm.

Examples of a method for arranging the molecule adhesive layer include amethod such that the first surface of the base material and the surfaceof the adjustment layer facing to the base material are surface-modifiedwith the molecule adhesive.

2. Wiring

The wiring in the present embodiment is a member which is positioned onthe first surface of the base material, and includes a bellows-likemember in which ridges and recesses in the normal direction of the firstsurface of the base material appear continuously along with in-planedirection of the first surface of the base material, and hasconductivity.

The stretchable circuit substrate of the present embodiment may includea plurality of the wiring. In examples shown in FIGS. 1A and 1B, thewiring 4 extends parallelly to the first direction D1 in which theridges 31, 33, 35 and recesses 32, 34, 36 of the bellows-like member 30continuously appear. Also, although not illustrated, the stretchablecircuit substrate may include a wiring which extends to a differentdirection from the first direction.

The amplitude of the bellows-like member is, for example, 1 μm or more,is preferably 10 μm or more, more preferably 50 μm or more, and furtherpreferably 100 μm or more. Also, the amplitude of the bellows-likemember is, for example, 500 μm or less, is preferably 400 μm or less,and more preferably 300 μm or less. The amplitude of the bellows-likemember being the above range allows the wiring to easily change its formso as to follow the expansion of the base material.

The amplitude of the bellows-like member refers to, as signified assigns S1 and S2 shown in FIG. 6, a distance between a ridge and a recessnext to each other in the normal direction to the first surface of thebase material. The amplitude S1 is an amplitude of the bellows-likemember 30 of the wiring 4 on the surface wiring which is the oppositesurface of the wiring 4 facing the base material, in the normaldirection to the base material. Also, the amplitude S2 is an amplitudeof the bellows-like member 30 of the wiring 4 on the surface facing thebase material wiring, in the normal direction of the base material.

The amplitude of the bellows-like member can be calculated by, forexample, measuring the distances in the normal direction to the firstsurface of the base material between the ridges and the recesses next toeach other in a certain range of the length direction of the wiring, andobtaining the average of the distances. The certain range of the lengthdirection of the wiring is, for example, 10 mm. As a measurement devicefor measuring the distances between the ridges and the recesses next toeach other, a non-contact type measurement device using means such as alaser microscope can be used, and a contact type measurement device iscan be used. Also, the distances between the ridges and the recessesnext to each other can be measured based on images such as a picture ofsection.

The cycle of the bellows-like member is, for example, 10 μm or more, ispreferably 50 μm or more, and more preferably 100 μm or more. Also, thecycle of the bellows-like member is, for example, 1000 μm or less, ispreferably 750 μm or less, and more preferably 500 μm or less. The cycleof the bellows-like member being the above range allows the wiring tostretch.

The cycle of the bellows-like member refers to a distance in the firstdirection D1 between ridges next to each other such as the one signifiedas a reference sign F in FIG. 6.

The cycle of the bellows-like member can be calculated by, for example,measuring distances in the first direction of the ridges next to eachother in a certain range of the length direction of the wiring, andobtaining the average of the distances. The certain range of the lengthdirection of the wiring is, for example, 10 mm. As a measurement devicefor measuring the distances between the ridges next to each other, anon-contact type measurement device using means such as a lasermicroscope can be used, and a contact type measurement device can beused. Also, the distances between the ridges next to each other can bemeasured based on images such as a picture of section.

The Young's modulus of the wiring is larger than the Young's modulus ofthe adjustment layer; for example, it is 100 MPa or more, and ispreferably 200 MPa or more. Also, the Young's modulus of the wiring is,for example, 300 GPa or less, is preferably 200 GPa or less, and morepreferably 100 GPa or less. Although stress concentration easily occursin cases where the Young's modulus of the wiring is the above range, thestress concentration can be reduced in the present embodiment since theadjustment layer is arranged.

The method for obtaining the Young's modulus of the wiring is in thesame manner as in the method for obtaining the Young's modulus of theadjustment layer described above.

A material of the wiring is any material that can follow the expansionand contraction of the base material using the elimination andgeneration of the bellows-like member. The material of the wiring can bestretchable or non-stretchable.

Examples of the non-stretchable material used for the wiring include ametal such as gold, silver, copper, aluminium, platinum, and chrome; andan alloy containing these metals. When the material of the wiring isnon-stretchable, a metal film may be used as the wiring.

The stretchability of the stretchable material used for the wiring canbe the same as the stretchability of the base material being stretchabledescribed later.

Examples of the stretchable material used for the wiring include aconductive composition containing conductive particles and an elastomer.In other words, the wiring can contain conductive particles and anelastomer. The conductive particles can be anything that can be used inthe wiring, and examples thereof include particles of gold, silver,copper, nickel, palladium, platinum, and carbon. Among them, silverparticles are preferably used. Also, as the elastomer, generalthermoplastic elastomers and thermosetting elastomers can be used, andexamples thereof include a styrene-based elastomer, an acrylicelastomer, an olefin-based elastomer, a urethane-based elastomer, asilicone rubber, a urethane rubber, a fluorine rubber, a nitrile rubber,polybutadiene, and polychloroprene.

The shape of the wiring in a plan view is not particularly limited butis preferably a straight line shape as illustrated in FIG. 1A. Thereason therefor is to easily design the stretchable circuit substrate.The wiring may function as an electrode. Examples of the electrodeinclude an electrode for a solar battery and an electrode for an organicelectroluminescence.

The thickness of the wiring is the thickness which tolerates thestretch, and can be appropriately selected depending on the factors suchas materials of the wiring.

For example, when the material of the wiring is non-stretchable, thethickness of the wiring can be 25 nm or more, is preferably 50 nm ormore, and more preferably 100 nm or more. Also, the thickness of thewiring may be 50 μm or less, is preferably 10 μm or less, and morepreferably 5 μm or less.

When the material of the wiring is stretchable, the thickness of thewiring can be 5 μm or more, is preferably 10 μm or more, and morepreferably 20 μm or more. Also, the thickness of the wiring can be 60 μmor less, is preferably 50 μm or less, and more preferably 40 μm or less.

The width of the wiring can be, for example, 50 μm or more, and can be10 mm or less as well.

A method for forming the wiring is appropriately selected depending onfactors such as materials. When the material of the wiring isnon-stretchable, examples of the method include a method in which ametal film is formed on the base material or on the supporting basematerial by means such as a vapor deposition method, a spatteringmethod, a plating method, or transferring and crimping a metal foil, andthen the metal film is subjected to patterning using a photolithographymethod. Also, when the material of the wiring is stretchable, examplesof the method includes a method in which a conductive compositioncontaining the above described conductive particles and elastomer isprinted on the supporting base material in a pattern using a generalprinting method.

3. Base Material Being Stretchable

The base material in the present embodiment is a member beingstretchable. The base material includes a first surface facing thewiring, and a second surface opposite to the first surface. The basematerial shall be, for example a member in a plate shape.

The base material is stretchable. Examples of the parameter thatexpresses the stretchability of the base material include a recovery.The recovery of the base material when it is expanded 50% (to the lengthof 1.5 times of the initial state) from the basis of the normal state(non-expanded state) and then released from the expanded state, ispreferably 80% or more, more preferably 85% or more, and furtherpreferably 90% or more. The upper limit of the recovery is 100%.

The recovery can be obtained in the manner such that a test piece having25 mm width is prepared, the test piece is expanded 50% and kept asexpanded for 1 hour, and then releasing from the expansion to recoverand leaving as is for 1 hour, and applying the following calculationformula:Recovery (%)=(length right after expanded−length afterrecovered)/(length right after expanded−length before expanded)*100.

The length right after expanded refers to the length in the stateexpanded 50%.

An additional example of the parameters that expresses thestretchability of the base material can be an elongation rate. It ispreferable that the base material can be expanded 1% or more from thenon-expanded state without being damaged, more preferably expanded 20%or more, and further preferably expanded 75% or more. The stretchablecircuit substrate can have the stretchability as a whole by adapting thebase material having such a stretchability. Further, the stretchablecircuit substrate can be used in products and applications that requireshigh stretch such that attached to apart of the human body such as arms.In general, it is said a product that is attached to human underarmsrequires the stretchability of 72% in the vertical direction, and 27% inthe horizontal direction. Also, it is said a product that is attached tohuman knees, elbows, buttocks, ankles, and armpits requires thestretchability of 26% or more and 42% or less in the vertical direction.Also, it is said a product that is attached to other parts of human bodyrequires the stretchability of less than 20%.

Also, it is preferable that the difference between the shape of the basematerial in non-expanded state and the shape of the base material whenit recovered to the non-stretched state again after it is expanded fromthe non-stretched state, is small. This difference is hereinafterreferred to as a change in form in some cases. The change in form of thebase material in the area rate can be, for example, 20% or less, is morepreferably 10% or less, and further preferably 5% or less. The formationof the bellows-like member becomes easy by adapting the base materialwith small change in its shape.

The Young's modulus of the base material can be, for example, 10 MPa orless, and is preferably 1 MPa or less. Also, the Young's modulus of thebase material can be 1 kPa or more. The stretchable circuit substrate,as a whole, can have the stretchability by adapting the base materialhaving such a Young's modulus.

The method for obtaining the Young's modulus of the base material is inthe same manner as in the method for obtaining the Young's modulus ofthe adjustment layer described above.

The material of the base material shall be the one that is stretchable,and examples thereof include an elastomer, which can be appropriatelyselected depending on applications of the stretchable circuit substrate.As the elastomer, general thermoplastic elastomers and thermosettingelastomers can be used, and specific examples thereof include astyrene-based elastomer, an olefin-based elastomer, a urethane-basedelastomer, an amide-based elastomer, a nitrile-based elastomer, avinyl-chloride-based elastomer, an ester-based elastomer, a1,2-polybutadiene-based elastomer, a fluorine-based elastomer, asilicone rubber, a urethane rubber, a fluorine rubber, polybutadiene,polyisobutyrene, polystyrenebutadiene, and polychloroprene. Inconsideration of mechanical strength and abrasion resistance, theurethane-based elastomer is preferably used. Also, the base material maycontain silicone. Silicone is excellent in heat resistance, chemicalresistance, and fire resistance, and thus is preferable as the materialfor the base material. Also, as the material for the base material, forexample, fabrics such as non-woven fabric, woven fabric, and knit can bealso used.

The thickness of the base material is not particularly limited and isappropriately selected depending on the material of the base material;for example, it can be 10 μm or more, is preferably 20 μm or more, andmore preferably 25 μm or more, also, can be 10 mm or less, is preferably3 mm or less, and more preferably 1 mm or less. The thickness of thebase material being the above value or more may secure the durability ofthe base material. Also, the thickness of the base material being theabove value or less secures wearing comfortability of the stretchablecircuit substrate. When the thickness of the base material is too thin,the stretchability of the base material is deteriorated in some cases.

In FIG. 7A, reference sign S3 signifies the amplitude of ridge 211 andrecess 212 appear on a part of the first surface 2 a of the basematerial 2 where the wiring region 21 overlaps with the bellows-likemember 30. As shown in FIG. 7A, when the rear surface (the surfacefacing the base material 2) of the wiring 4 and the first surface 2 a ofthe base material 2 are positioned nearby, the amplitude S3 of the ridge211 and the recess 212 on the first surface 2 a of the base material 2is almost equal to the amplitude S2 of the bellows-like member 30 on therear surface of the wiring 4. Also, when the rear surface (the surfacefacing the base material 2) of the wiring 4 contacts the first surface 2a of the base material 2, the amplitude S3 of the ridge 211 and therecess 212 on the first surface 2 a of the base material 2 is almostequal to the amplitude S2 of the bellows-like member 30 on the rearsurface of the wiring 4.

FIGS. 1A and 1B show an example in which the bellows-like member doesnot appear on the second surface 2 b of the base material 2, but theembodiment is not limited thereto. As shown in FIG. 7A, the bellows-likemember may also appear on the second surface 2 b of the base material 2.In FIG. 7A, reference numerical 213 and 214 signify a ridge and a recessappear on the second surface 2 b of the base material 2 in the wiringregion 21. In the example shown in FIG. 7A, the ridge 213 of the secondsurface 2 b appears at the position that overlaps with the recess 212 ofthe first surface 2 a, and the recess 214 of the second surface 2 bappears at the position that overlaps with the ridge 211 of the firstsurface 2 a. Although not illustrated, the position of the ridge 213 andthe recess 214 on the second surface 2 b of the base material 2 may notoverlap the recess 212 and the ridge 211 on the first surface 2 a. Thenumber or the cycle of the ridge 213 and the recess 214 on the secondsurface 2 b of the base material 2 may be the same as or different fromthe number or the cycle of the ridge 211 and the recess 212 on the firstsurface 2 a. For example, the cycle of the ridge 213 and the recess 214on the second surface 2 b of the base material 2 may be larger than thecycle of the ridge 211 and the recess 212 on the first surface 2 a. Inthis case, the cycle of the ridge 213 and the recess 214 on the secondsurface 2 b of the base material 2 may be 1.1 times or more of the cycleof the ridge 211 and the recess 212 on the first surface 2 a, may be 1.5times or more thereof, and may be 2.0 times or more thereof. “The cycleof the ridge 213 and the recess 214 on the second surface 2 b of thebase material 2 is larger than the period of the ridge 211 and therecess 212 on the first surface 2 a” is a concept including the casewhere the ridge and the recess do not appear on the second surface 2 bof the base material 2.

In FIG. 7A, reference sign S4 signifies the amplitude of the ridge 213and the recess 214 appear on a part of the second surface 2 b of thebase material 2 where the wiring region 21 overlaps with thebellows-like member 30. The amplitude S4 on the second surface 2 b maybe the same as or different from the amplitude S3 on the first surface 2a. The amplitude S4 on the second surface 2 b may be smaller than theamplitude S3 on the first surface 2 a. For example, the amplitude S4 onthe second surface 2 b may be 0.9 times or less of the amplitude S3 onthe first surface 2 a, and may be 0.6 times or less. Also, the amplitudeS4 on the second surface 2 b may be 0.1 times or more of the amplitudeS3 on the first surface 2 a, and may be 0.2 times or more. When thethickness of the base material 2 is small, the rate of the amplitude S4on the second surface 2 b with respect to the amplitude S3 on the firstsurface 2 a tends to increase. “The amplitude of the ridge 213 and therecess 214 on the second surface 2 b of the base material 2 is smallerthan the amplitude of the ridge 211 and the recess 212 on the firstsurface 2 a” is a concept including the case where the ridge and therecess do not appear on the second surface 2 b of the base material 2.

FIG. 7A shows an example in which the positions of the ridge 213 and therecess 214 on the second surface 2 b match the positions of the recess211 and the ridge 212 on the first surface 2 a, but the embodiment isnot limited thereto. As shown in FIG. 7B, the positions of the ridge 213and the recess 214 on the second surface 2 b may be shifted in just Jfrom the positions of the recess 211 and the ridge 212 on the firstsurface 2 a. The shift amount J is, when F3 designates the cycle of theridge 211 and the recess 212 appear on the first surface 2 a of the basematerial where overlaps with the bellows-like member 30, for example,0.1*F3 or more, and may be 0.2*F3 or more.

The stretchable circuit substrate of the present embodiment may comprisejust one layer of the base material, and may comprise two or more layersof the base material. For example, in FIG. 8, the base material 2includes a first base material 2α and a second base material 2β in thisorder from the wiring 4 side. The Young's moduluses of the first basematerial 2α and the second base material 2β may be the same and may bedifferent. Above all, the Young's modulus of the first base material 2αis preferably smaller than the Young's modulus of the second basematerial 2β. In this case, the first base material 2α havingcomparatively small Young's modulus functions as a supporting layer ofthe adjustment layer, and the second base material 2β havingcomparatively large Young's modulus functions as a contraction improvinglayer. The Young's modulus of the first base material 2α can be lessthan 1 time of the Young's modulus of the second base material 2β, ispreferably 0.9 times or less thereof, and more preferably 0.7 times orless thereof. Also, the Young's modulus of the first base material 2αcan be 0.01 times or more of the Young's modulus of the second basematerial 2β, and is preferably 0.05 times or more thereof. Also, forexample, when the base material 2β is fabric, the elasticity dropssharply if it exceeds the threshold level; thus, it functions as alimiter that prevents the stretchable circuit substrate from beingexpanded too much. The materials of the first base material 2α and thesecond base material 2β may be the same and may be different. Thethicknesses of the first base material 2α and the second base material2β may be the same and may be different. The thickness of the first basematerial 2α is, for example, preferably larger than the amplitude (S2)of the ridge and the recess appear on the surface of the wiring whichfaces base material wiring at a part of the wiring region which overlapswith the bellows-like member. Also, the thickness of the first basematerial 2α is, for example, preferably larger than the amplitude (S3)of the ridge and the recess appear on the first surface of the basematerial at a part among the wiring region which overlaps with thebellows-like member.

4. Functional Member

The stretchable circuit substrate of the present embodiment may includea functional member which is positioned on the first surface side of thebase material, and also positioned in the functional member region whichis adjacent to the wiring region and to which a functional member ismounted.

The functional member is appropriately selected depending on theapplications of the stretchable circuit substrate; the functional membermay be an active element, may be a passive element and may be amechanical element. Examples of the functional member include atransistor, a LSI (Large-Scale Integration), MEMS (Micro ElectroMechanical Systems), a relay, a light emitting element such as an LED,an OLED or a LCD, a sensor, a sound element such as a buzzer, avibration element that emits vibration, a cool and heat generating partfor controlling the cool and heat generation such as a Peltier elementor a heating wiring, a resistor, a capacitor, an inductor, apiezoelectric element, a switch, and a connector.

Among the above, the sensor is preferably used. Examples of the sensorinclude a temperature sensor, a pressure sensor, a light sensor, aphotoelectron sensor, a proximity sensor, a shearing force sensor, amagnetic sensor, a laser sensor, a microwave sensor, a humidity sensor,a distortion sensor, a gyro sensor, an acceleration sensor, a deviationsensor, a gas sensor, a GPS sensor, an ultrasonic wave sensor, an odorsensor, a brain wave sensor, a current sensor, a vibration sensor, apulse wave sensor, a cardio sensor, and an illuminance sensor. Inparticular, the sensor is preferably a biosensor that can measurebio-information such as heart rate or pulse rate, cardio, bloodpressure, body temperature, blood oxygenation level, myoelectricity, andbrain wave.

The functional member is connected to the wiring. Regarding theconnection structure of the functional member and the wiring, generalstructures can be applied.

The surroundings of the functional member can be covered with a resinsuch as a potting agent in order to reinforce the electronicallyconnected part where the functional member is connected to the wiring.Thereby, mechanical reliability of the electronically connected part ofthe functional member and the wiring can be improved.

The functional member may and may not include a bellows-like shape; thebellows-like member may be included when the functional member cantolerate the stretch. For example, when the functional member is TFT orOLED, it may include the bellows-like member. The functional memberregion may and may not have a bellows-like shape. In the latter case,the functional member region is, for example, preferably in a flatshape.

As the functional member, apart of the wiring may be used. In otherwords, the wiring may include a functional element part. The functionalelement part may be arranged at, for example, the end part of thewiring, and may be arranged at the middle part of the wiring. In theexample shown in FIG. 9A, functional element part 411 has a width widerthan that of a routing part (the part other than the functional elementpart) of the wiring 4. Outer periphery 412 of the functional elementpart 411 is the part where width changes. The functional element part411 shown in FIG. 9A may, for example, functions as a pad. To the pad,for example, a probe for inspection or a terminal for rewriting softwaremay be connected. FIG. 9B is a plan view illustrating an additionalexample of the functional element part 411. In the example shown in FIG.9B, the functional element part 411 has a shape that extends in a spiralshape. The outer periphery 412 of the functional element part 411 is thepart where the spiral shape starts to extend. An electrode partincluding a specific pattern as shown in FIG. 9B may function as, forexample, an antenna and a pressure sensor.

5. Supporting Base Material

The stretchable circuit substrate of the present embodiment may includea supporting base material between the base material and the wiring.Also, when the stretchable circuit substrate of the present embodimentcomprises the functional member, the supporting base material can beincluded between the base material and the wiring as well as thefunctional member. The supporting base material is a member thatsupports the wiring and the functional member. FIGS. 3A to 3D areexamples in which the stretchable circuit substrate includes thesupporting base material 7 between the base material 2 and the wiring 4as well as the functional member 5.

When the supporting base material is positioned between the basematerial and the wiring, in the production method of the stretchablecircuit substrate of the present embodiment, the bellows-like member isformed on the supporting base material and the wiring when the basematerial bonded to the supporting base material is contracted byreleasing the tensile stress. The characteristics and the size of thesupporting base material are designed so as to easily form such abellows-like member.

The supporting base material has, for example, a Young's modulus largerthan the Young's modulus of the base material. The Young's modulus ofthe supporting base material can be, for example, 100 Mpa or more, andis preferably 1 GPa or more. Also, the Young's modulus of the supportingbase material can be, for example, 100 times or more and 50000 times orless of the Young's modulus of the base material, and is preferably 1000times or more and 10000 times or less thereof. The Young's modulus ofthe supporting base material is designed in this manner, and thus theperiod of the bellows-like member may be prevented from being too small.Also, it may inhibit the generation of a local bend in the bellows-likemember. Also, if the Young's modulus of the supporting base material istoo large, the base material would have difficulty recovering when it isrelaxed, and a crack and a bend would be easily generated in the basematerial. Also, as described later, when the stretchable circuitsubstrate of the present embodiment comprises a plurality of the stretchcontrolling part positioned in the wiring region and arranged along withthe first direction in which the ridges and the recesses of thebellows-like member continuously appear, if the Young's modulus of thesupporting base material is too small, the supporting base materialwould easily change its form during the step of forming the stretchcontrolling part; as a result, the stretch controlling part would havedifficulty matching its position to the wiring and the functionalmember.

Also, the Young's modulus of the supporting base material may be 100times or less of the Young's modulus of the base material.

Incidentally, the method for obtaining the Young's modulus of thesupporting base material is in the same manner as in the method forobtaining the Young's modulus of the adjustment layer described above.

The supporting base material usually includes a bellows-like member. Thebellows-like member may be the same as the bellows-like member includedin the wiring described above.

The supporting base material may be the one that tolerate the stretch,and examples thereof may include a resin base material. Specificexamples of the material constituting the resin base material mayinclude polyester such as polyethylene naphthalate and polyethyleneterephthalate, polyimide, polyamide, polycarbonate, polyolefin, acycloolefin polymer, and an acrylic resin. Among them, polyethylenenaphthalate or polyimide is preferably used since their durability andheat resistance are good.

The thickness of the supporting base material may be a thickness whichcan be stretched when the bellows-like member is included; for example,it may be 500 nm or more, and is preferably 1 μm or more, also, may be10 μm or less, and is preferably 5 μm or less. If the thickness of thesupporting base material is too thin, it would be difficult to handlethe supporting base material in the step of producing the supportingbase material and in the step of forming a member on the supporting basematerial. Also, if the thickness of the supporting base material is toothick, the base material would have difficulty recovering during beingrelaxed, and the intended stretch of the base material may not beobtained in some cases.

An adhesive layer may be arranged between the supporting base materialand the base material.

Incidentally, below, the adhesive layer positioned between thesupporting base material and the base material may be referred to as asecond adhesive layer in some cases.

There are no particular limitations on the second adhesive layer andgeneral adhesives and pressure sensitive adhesives used for circuitsubstrates may be used.

The second adhesive layer usually includes a bellows-like member. Thebellows-like member may be the same as the bellows-like member includedin the wiring described above.

The thickness of the second adhesive layer may be a thickness which isstretchable and with which the supporting base material can be attachedto the first surface side of the base material; for example, it may bein a range of 5 μm or more and 200 μm or less, and is preferably in arange of 10 μm or more and 100 μm or less.

Also, the second adhesive layer may be a molecule adhesive layer. In thepresent disclosure, the base material and the supporting base materialmay be adhesively bonded with chemical bonding using the moleculeadhesive.

The molecule adhesive layer may be the same as that described for thefirst adhesive layer above.

Examples of the method for arranging the molecule adhesive layer mayinclude a method in which the first surface of the base material, andthe surface of the supporting base material which is opposite sidesurface to the wiring and the functional member side surface, aresurface-modified with the molecule adhesive.

6. First Stretch Controlling Part

The stretchable circuit substrate of the present embodiment may comprisea plurality of a stretch controlling part which is positioned on thefirst surface side of the base material, the second surface side of thebase material, or inside the base material, as well as in the wiringregion, and arranged along with the first direction in which the ridgesand the recesses of the bellows-like member continuously appear.Incidentally, below, this stretch controlling part may be referred to asa first stretch controlling part in some cases.

The first stretch controlling part is a member arranged for controllingthe stretch of the base material.

FIGS. 10A and 10B are a schematic plan view and a cross-sectional viewillustrating an additional example of the stretchable circuit substrateof the present embodiment, and FIG. 10B is a cross-sectional view of B-Bline in FIG. 10A. As shown in FIGS. 10A and 10B, the stretchable circuitsubstrate 1 may comprise a plurality of the first stretch controllingpart 41 which is positioned in the wiring region 21, and arranged alongwith the first direction D1 in which the ridges 31, 33, 35 and therecesses 32, 34, 36 of the bellows-like member 30 continuously appear.In FIGS. 10A and 10B, the first stretch controlling part 41 ispositioned on the first surface 2 a side of the base material 2, andalso positioned on the surface of the wiring 4 which is opposite sidesurface to the base material 2 side surface, and on the surface of theadjustment layer 3 which is opposite side surface to the base material 2side surface.

The first stretch controlling part is arranged in the wiring region, andthus structures such as the period and the amplitude of the bellows-likemember may be controlled. Accordingly, generation of a local large curveand bend in the wiring can be inhibited. Thereby, the damage of thewiring can be inhibited.

FIG. 11 is an enlarged view of the wiring region in FIG. 10B. As shownin FIG. 11, in the wiring region, in the in-plane direction of the firstsurface 2 a of the base material 2, a plurality of the first stretchcontrolling part 41 is arranged in period F2, along with the firstdirection D1 in which the ridge 31 and the recess 32 continuouslyappear. Thus, in the base material 2, a part that easily stretches and apart not easily stretches are continuously present in the period F2along with the direction to which the wiring 4 extends. In this case,when the base material 2 is relaxed, the bellows-like member 30 havingthe period F1 that corresponds to the period F2 of the first stretchcontrolling part 41 may be easily generated in the wiring 4. In otherwords, the period F1 of the bellows-like member 30 may be controlled bythe first stretch controlling part 41.

Below, advantages of controlling the period of the bellows-like memberwill be described. When a plurality of the first stretch controllingpart is arranged in the period F2 along with the first direction inwhich the bellows-like member appears, the period F1 of the bellows-likemember appears in the wiring may be controlled. Thereby, it is possibleto inhibit the height of the ridge in the bellows-like member frombecoming locally large due to the period F1 of the bellows-like memberbeing disordered. Accordingly, it is possible to inhibit the wiring frombeing damaged due to large stress to the wiring.

Incidentally, the period of the bellows-like member signifies an averagevalue of the distances between a plurality of the ridges in thebellows-like member, in the first direction. Also, the period of thefirst stretch controlling part signifies an average value of thedistances between a plurality of the first stretch controlling part, inthe first direction. Incidentally, below, the period of the bellows-likemember may be referred to as a first period, and the period of the firststretch controlling part may be referred to as a second period in somecases.

If the control of the first period in the bellows-like member by thefirst stretch controlling part is appropriately achieved, the firststretch controlling part would be arranged in the second period thatcorresponds to the first period of the bellows-like member. In theexample shown in FIG. 11, the second period F2 of the first stretchcontrolling part 41 is equal to the first period F1 of the bellows-likemember. In this case, the first stretch controlling part 41 ispositioned at the part of specific phase in the bellows-like member; forexample, it is positioned at the ridge 32 in the bellows-like member. Aplurality of the first stretch controlling part is preferably arrangedin the period corresponding to the period of the bellows-like member.

Incidentally, the first period of the bellows-like member that appearsin the wiring arranged on the base material may not match the secondperiod of the plurality of the first stretch controlling part in somecases, depending on the Young's modulus and the thickness of the basematerial. For example, there may be both cases the second period of thefirst stretch controlling part is larger than the first period of thebellows-like member, and is smaller than the first period of thebellows-like member. In both cases, the part where the first stretchcontrolling part is arranged among the wiring region would easily be thepart of the specific phase in the bellows-like member. For example, thepart where the first stretch controlling part is arranged in the basematerial may be the ridge or the recess of the bellows-like member.Thereby, it is possible to inhibit the first period of the bellows-likemember from being disordered; thus, it is possible to inhibit the heightof the ridge in the bellows-like member from becoming locally large.

In this manner, the plurality of the first stretch controlling part mayattain the roll of controlling the first period of the bellows-likemember generated in the wiring.

The second period of the first stretch controlling part may be, forexample, m times or 1/n of the first period of the bellows-like member.Here, “m” and “n” are a positive integer. It is preferable that “m” is 3or less and “n” is 4 or less. The second period of the first stretchcontrolling part may be, for example, 5 μm or more and 10 mm or less.

The Young's modulus of the first stretch controlling part may be largerthan the Young's modulus of the base material, and may be equal or lessthan the Young's modulus of the base material.

When the Young's modulus of the first stretch controlling part is largerthan the Young's modulus of the base material, the Young's modulus ofthe first stretch controlling part may be, for example, 10 GPa or moreand 500 GPa or less, and is preferably 1 GPa or more and 300 GPa orless. If the Young's modulus of the first stretch controlling part istoo small, it may be difficult to control the stretch in some cases.Also, when the Young's modulus of the first stretch controlling part istoo large, damage of the structure such as a crack and a line in thefirst stretch controlling part may occur in some cases when the basematerial is stretched.

In this case, the Young's modulus of the first stretch controlling partmay be, for example, 1.1 times or more and 5000 times or less of theYoung's modulus of the base material, and is preferably 10 times or moreand 3000 times or less thereof. Arrangement of such a first stretchcontrolling part in the base material may inhibit the stretch of thepart where the base material overlaps the first stretch controlling partin a plan view. Thus, the base material may be divided into a parteasily stretches and a part not easily stretches. Thereby, structuressuch as the period and the amplitude of the bellows-like member appearsin the base material may be controlled.

Incidentally, the method for obtaining the Young's modulus of the firststretch controlling part is the same as for the case of the adjustmentlayer described above.

When the Young's modulus of the first stretch controlling part is largerthan the Young's modulus of the base material, as the materialconstituting the first stretch controlling part, a metal material may beused. Examples of the metal material may include copper, aluminium, andstainless steel. Also, as the material constituting the first stretchcontrolling part, general thermoplastic elastomer, acrylic,urethane-based, epoxy-based, polyester-based, vinylether-based,polyen-thiol-based, or silicone-based oligomer and polymer may be usedas well.

The thickness of the first stretch controlling part may be, for example,1 μm or more and 100 μm or less.

Also, when the Young's modulus of the first stretch controlling part isequal to or less than the Young's modulus of the base material, theYoung's modulus of the first stretch controlling part may be, forexample, 10 MPa or less, and may be 1 MPa or less. Also, the Young'smodulus of the first stretch controlling part may be, for example, 1time or less of the Young's modulus of the base material, and may be 0.8times or less thereof. In this case, the amplitude of the bellows-likemember appears in the base material would be larger than that when theYoung's modulus of the first stretch controlling part is larger than theYoung's modulus of the base material, and thus the stretchability of thestretchable circuit substrate would also be larger. Also, even when theYoung's modulus of the first stretch controlling part is equal to orless than the Young's modulus of the base material, there may bedifference in the stretchability between the part where the basematerial overlaps the first controlling part in a plan view, and thepart where the base material does not overlap the first stretchcontrolling part in a plan view. In other words, the base material maybe divided into the part easily stretches and the part not easilystretches. Thereby, structures such as the period and the amplitude ofthe bellows-like member appears in the base material may be controlled.

When the Young's modulus of the first stretch controlling part is equalto or less than the Young's modulus of the base material, as a materialconstituting the first stretch controlling part, general thermoplasticelastomers and thermosetting elastomers may be used, and examplesthereof may include a styrene-based elastomer, an acrylic elastomer, anolefin-based elastomer, a urethane-based elastomer, a silicone rubber, aurethane rubber, a fluorine rubber, a nitrile rubber, polybutadiene, andpolychloroprene.

The thickness of the first stretch controlling part may be, for example,1 μm or more and 100 μm or less.

Also, the characteristics of the first stretch controlling part may beexpressed with bending rigidity instead of the Young's modulus. In otherwords, the bending rigidity of the first stretch controlling part may belarger than the bending rigidity of the base material, and may be equalto or less than the bending rigidity of the base material.

Incidentally, the cross-sectional secondary moment of the first stretchcontrolling part may be calculated based on a cross-section obtained bycutting the first stretch controlling part in a plane orthogonal to thestretch direction of the stretchable circuit substrate.

When the bending rigidity of the first stretch controlling part islarger than the bending rigidity of the base material, the bendingrigidity of the first stretch controlling part may be, for example, 1.1times or more of the bending rigidity of the base material, ispreferably 2 times or more thereof, and further preferably 10 times ormore thereof.

Also, when the bending rigidity of the first stretch controlling part isequal to or less than the bending rigidity of the base material, thebending rigidity of the first stretch controlling part may be, forexample, 1 times or less of the bending rigidity of the base material,and may be 0.8 times or less thereof.

The first stretch controlling part may have uniform deformationproperties, and may be configured so as to show different deformationdepending on positions. For example, when the first stretch controllingpart has uniform thickness, it may have uniform deformation properties.Also, the first stretch controlling part may include a first part, and asecond part that has higher deformation properties than that of thefirst part; in this case, the first stretch controlling part may beconfigured so as to show different deformation depending on positions.

In the first controlling part 41, for example, as shown in FIGS. 12A and12B, the first part 41 a may constitute the central part of the firststretch controlling part 41 in the first direction D1, and the secondpart 41 b may constitute the both edges of the first stretch controllingpart 41 in the first direction D1. In other words, the first stretchcontrolling part 41 may include the first part 41 a, and a pair of thesecond part 41 b interposing the first part 41 a. Incidentally, FIG. 12Ais a cross-sectional view showing the stretchable circuit substrate in astretched state, and FIG. 12B is a cross-sectional view showing thestretchable circuit substrate shown in FIG. 12A in a relaxed state.

Also, although not illustrated, in the first stretch controlling part,the second part may constitute the central part of the first stretchcontrolling part, and the first part may constituted the both edges ofthe first stretch controlling part.

The thickness of the second part in the first stretch controlling partmay be thinner than the thickness of the first part. Also, the thicknessof the second part may, at least partially, reduced along with distancedfrom the first part. In the example shown in FIG. 12A, the thickness ofthe second part 41 b monotonously reduces along with distanced from thefirst part 41 a side. In this case, the deformation properties of thewiring region in the base material would be higher along with thedirection toward the edge of the first stretch controlling part. As aresult, as shown in FIG. 12B, the central part of the first stretchcontrolling part 41, which is the first part 41 a here, would be easilythe part of the specific phase in the bellows-like member such as arecess. Also, the first part easily changes its form to follow the shapeof the ridge or the recess in the bellows-like member. Thereby, thedeformation properties and the stretchability of the wiring region inthe base material may be maintained while the stability of the period ofthe bellows-like member is secured with the central part of the firststretch controlling part.

The first stretch controlling part 41 may, for example, as shown in FIG.13A, have a shape of hemisphere. In this case, the thickness of thefirst stretch controlling part around its edge gradually reduces towardsthe edge. Accordingly, the above described first part and second partmay be configured in the first stretch controlling part.

In this case also, the first part in the first stretch controlling partwould easily be the part of the specific phase in the bellows-likemember. Also, the second part in the first stretch controlling parteasily changes its form to follow the shape of the ridge or the recessin the bellows-like member. Thereby, the deformation properties and thestretchability of the wiring region in the base material may bemaintained while the stability of the period of the bellows-like memberis secured.

In the first stretch controlling part, for example, as shown in FIG.13B, the distribution density of the second part 41 b in the firststretch controlling part 41 may be smaller than the density distributionof the first part 41 a in the first stretch controlling part 41. In theexample shown in FIG. 13B, the second part 41 b includes a plurality ofmembers arranged with a space between each other. Also, the densitydistribution of the second part may be gradually smaller along withdistanced from the first part. For example, the width of the pluralityof members configured in the second part may be gradually smaller alongwith distanced from the first part, and also, the space between theplurality of members configured in the second part may be graduallylarger along with distanced from the first part. Each member in thesecond part is, for example, configured by the member same as that inthe first part.

In this case also, the deformation properties of the wiring region inthe base material would be higher in the second part of the firststretch controlling part compared to that in the first part. Thus, thefirst part would easily be the part of the specific phase in thebellows-like member. Also, the second part easily changes its form tofollow the shape of the ridge or the recess of the bellows-like member.Thereby, the deformation properties and the stretchability of the wiringregion in the base material may be maintained while the stability of theperiod of the bellows-like member is secured.

Also, when the stretchable circuit substrate of the present embodimentcomprises the supporting base material between the base material and thewiring, in the first stretch controlling part, for example, as shown inFIG. 13C, the second part 41 b in the first stretch controlling part 41may be configured as a space part between the supporting base material 7and the base material 2. In this case, the first part 41 a in the firststretch controlling part 41 may be configured by a member that canfunction as an adhesive for adhering the supporting base material 7 tothe base material 2. The deformation properties of the second part 41 bare higher than the deformation properties of the first part 41 a sinceno member is present in the second part 41 b. Accordingly, the firstpart 41 a would easily be the part of the specific phase in thebellows-like member. Also, the second part 41 b does not interfere thegeneration and deformation of the bellows-like member. Thereby, thedeformation properties and the stretchability of the wiring region inthe base material may be maintained while the stability of the period ofthe bellows-like member is secured.

In the first stretch controlling part, the Young's modulus of the secondpart may be smaller than the Young's modulus of the first part. In thiscase, the deformation properties of the wiring region in the basematerial would be higher in the second part of the first stretchcontrolling part compared to the first part. Accordingly, the first partwould easily be a part of the specific phase in the bellows-like member.Also, the second part would easily change its form to follow the shapeof the ridge or the recess in the bellows-like member. Thereby, thedeformation properties and the stretchability of the wiring region inthe base material may be maintained while the stability of the period ofthe bellows-like member is secured.

Also, when the stretchable circuit substrate of the present embodimentcomprises the supporting base material between the base material and thewiring, and when the first stretch controlling part is positionedbetween the supporting base material and the base material, the firststretch controlling part may be configured so as the Young's modulus ofthe second part in the first stretch controlling part becomes smallerthan the Young's modulus of the first part. In this case, the firststretch controlling part may be configured by a member that can functionas an adhesive for adhering the supporting base material to the basematerial.

As the first stretch controlling part, for example, as shown in FIG.13D, at least two of the first stretch controlling part 41 may bepositioned in the range of the first period of the bellows-like memberand may contact with each other. In this case, when the height of theridge in the bellows-like member is about to made expanded, the firststretch controlling parts contacting with each other would be compressedand repulsive force occurs. Thereby, it is possible to inhibit theexpansion in the height of the ridge in the bellows-like member in whichthe first stretch controlling parts contacting with each other arearranged.

The first stretch controlling part may be positioned on the firstsurface side of the base material, may be positioned on the secondsurface side of the base material, and may be positioned inside the basematerial.

When the first stretch controlling part is positioned on the firstsurface side of the base material, the first stretch controlling part 41may be, for example, positioned on the surface of the wiring 4 which isopposite side surface to the base material 2 side surface as shown inFIG. 11, and may be positioned between the base material 2 and thewiring 4 as shown in FIG. 14A. When the first stretch controlling partis positioned between the base material and the wiring, the firststretch controlling part may be positioned on the first surface of thebase material, and may be positioned in a concave part designed on thefirst surface of the base material. Also, when the stretchable circuitsubstrate of the present embodiment comprises the supporting basematerial between the base material and the wiring, the first stretchcontrolling part may be positioned on the surface of the wiring which isopposite side surface to the supporting base material side surface, andmay be positioned between the supporting base material and the wiring.

When the first stretch controlling part is positioned inside the basematerial, for example, as shown in FIG. 14B, the first stretchcontrolling part 41 is embedded inside the base material 2. Such a basematerial and a first stretch controlling part may be obtained by, forexample, injecting the first stretch controlling part at an appropriatetiming into a mold when the base material is fabricated by pouring aresin into the mold and the resin in the mold is solidified.

When the first stretch controlling part is positioned on the secondsurface side of the base material, the first stretch controlling part 41may be, for example, configured separately from the base material 2 asshown in FIG. 14C, and may be configured integrally with the basematerial 2 as shown in FIGS. 14D and 14E. Also, when the first stretchcontrolling part is configured integrally with the base material, thefirst stretch controlling part 41 may be, for example, may be a convexpart designed in the base material 2 as shown in FIG. 14B, and may be aconcave part designed in the base material 2 as shown in FIG. 14C.Incidentally, “integrally” means that there is no interface between thebase material and the first stretch controlling part.

When the first stretch controlling part configured with the concave partis arranged in the base material also, parts easily stretch and partsnot easily stretch would continuously appear in the wiring region of thebase material along with the direction to which the wiring extends.Thereby, it is possible to inhibit the height of the ridge in thebellows-like member from becoming locally large due to the period of thebellows-like member being disordered. Accordingly, it is possible toinhibit the wiring from being damaged due to large stress to the wiring.

The first stretch controlling part 41 may be, for example, as shown inFIGS. 15A and 15B, arranged on both of the first surface 2 a side andthe second surface 2 b side of the base material 2. In this case, asshown in FIG. 15A, the first stretch controlling part 41 may bepositioned so as the first part 41 a of the first stretch controllingpart 41 positioned on the first surface 2 a side of the base material 2does not overlap with the first part 41 a of the first stretchcontrolling part 41 positioned on the second surface 2 b side of thebase material 2 in a plan view. Incidentally, FIG. 15A is across-sectional view illustrating the stretchable circuit substrate in astretched state, and FIG. 15B is a cross-sectional view illustrating thestretchable circuit substrate in the FIG. 15B is in a relaxed state. Inthe example shown in FIG. 15B, the first stretch controlling part 4 lpositioned on the first surface 2 a side of the base material 2corresponds to the recess in the bellows-like member, and the firststretch controlling part 41 positioned on the second surface 2 b side ofthe base material 2 corresponds to the ridge in the bellows-like member.

The first stretch controlling part 41 may be, for example, positioned soas to overlap the wiring 4 in a plan view as shown in FIG. 10A, and maybe positioned so as not to overlap the wiring 4 in a plan view as shownin FIG. 16A. Incidentally, in FIG. 16A, the adjustment layer is omitted.

When the first stretch controlling part does not overlap the wiring in aplan view, the first stretch controlling part and the wiring may bepositioned in the same plane. Even when the first stretch controllingpart does not overlap the wiring in a plan view, it is possible toinhibit the height of the ridge in the bellows-like member from becominglocally large due to the period of the bellows-like member beingdisordered if a plurality of the first stretch controlling part isarranged along with the first direction where the bellows-like memberappears. Accordingly, it is possible to inhibit the wiring from beingdamaged due to large stress to the wiring. Incidentally, when the firststretch controlling part and the wiring are positioned in the sameplane, the both may be simultaneously formed in the same step.

There are no particular limitations on the shape of the first stretchcontrolling part in a plan view. For example, as shown in FIG. 10A, thefirst stretch controlling part 41 may extends to the direction crossingthe first direction D1 where the bellows-like member appears, such as tothe direction orthogonal to D1. The first stretch controlling part 41may have a circle shape as shown in FIG. 16B, and the first stretchcontrolling part 41 may have a honeycomb shape as shown in FIG. 16C.Incidentally, in FIGS. 16B and 16C, the adjustment layer is omitted.When the first stretch controlling part has the circle shape, the circleshape may be in a shape of a perfect circle, and may be in a shape ofoval.

The circle shape and the honeycomb shape are isotropic shapes comparingto a square shape. For this reason, isotropic expansion may be generatedat the part where the first stretch controlling part overlaps with thebase material in a plan view and around that part, when a force such astensile stress is applied to the base material.

The method for forming the first stretch controlling part may beappropriately selected depending on factors such as materials. Examplesof the method may include a method in which a metal film is formed onthe base material or on the supporting base material with means such asa vapor deposition method and a spattering method, and then the metalfilm is subjected to patterning using a photolithography method. Also,examples of the method may include a method in which a resin film suchas an organic layer is formed entirely on the base material or on thesupporting base material by methods such as a coating method using meanssuch as a spin coating method, and then the resin film is subjected topatterning using a photolithography method. Also, examples of the methodmay include a method in which the material of the first stretchcontrolling part is printed on the base material or on the supportingbase material in a pattern using a general printing method. Among thesemethods, the printing method, with which material efficiency is good andproduction is inexpensive, is preferably used.

7. Second Stretch Controlling Part

The stretchable circuit substrate of the present embodiment may comprisea second stretch controlling part positioned on the first surface sideof the base material, on the second surface side of the base material,or inside the base material. The second stretch controlling part may bepositioned in the functional member surrounding region which ispositioned around the functional member region, and may be extended tothe border between the functional member surrounding region and thefunctional member region.

As shown in FIGS. 10A and 10B, the stretchable circuit substrate 1 maycomprise the second stretch controlling part 42 which is positioned inthe functional member surrounding region 23 positioned around thefunctional member region 22, and which extends to the border between thefunctional member surrounding region 23 and the functional member region22. In FIGS. 10A and 10B, the second stretch controlling part 42 extendsto the functional member region 22 exceeding the border between thefunctional member surrounding region 23 and the functional member region22, and is positioned in the entire region of the functional memberregion 22. Also, the second stretch controlling part 42 is positioned onthe first surface 2 a side of the base material 2, as well as positionedon the surface of the functional member 5 which is opposite side surfaceto the base material 2 ide surface and on the surface of the adjustmentlayer 3 which is opposite side surface to the base material 2 sidesurface.

The second stretch controlling part is arranged in the functional membersurrounding region, and also, the second stretch controlling partextends to the border between the functional member surrounding regionand the functional member region, and thus generation of the large ridgein the wiring near the functional member can be inhibited. Thereby, thedamage of the electronically connected part between the functionalmember and the wiring can be inhibited.

Incidentally, configurations such as Young's modulus, bending rigidity,material, and thickness of the second stretch controlling part may bethe same as those of the first stretch controlling part described above.

The Young's modulus of the first stretch controlling part and theYoung's modulus of the later described second stretch controlling partmay be equal. In this case, the first stretch controlling part and thesecond stretch controlling part may be simultaneously formed in the samestep, and thus the step of forming the first stretch controlling partwould be convenient.

Also, the Young's modulus of the first stretch controlling part and theYoung's modulus of the second stretch controlling part may be different.In this case, it is preferable that the Young's modulus of the secondstretch controlling part is larger than the Young's modulus of the firststretch controlling part.

When E1 designates the Young's modulus of the base material, E21designates the Young's modulus of the second stretch controlling part,and E22 designates the Young's modulus of the first stretch controllingpart, examples of the combination are as follows:E1<E21=E22;  Example 1:E1<E22<E21;  Example 2:E22≤E1<E21; and  Example 3:E21=E22≤E1.  Example 4:

The thickness and the material of the first stretch controlling part andthe thickness and the material of the second stretch controlling partmay be the same. In this case, the step of forming the first stretchcontrolling part would be convenient.

Also, the material and the thickness of the first stretch controllingpart and the material and the thickness of the second stretchcontrolling part may be different. In this case, it is preferable thatthe thickness of the second stretch controlling part is thinner than thethickness of the first stretch controlling part. This is because thefunctional member is thicker than the wiring in general. When thethickness of the second stretch controlling part is thinner than thethickness of the first stretch controlling part, the concave, convex,and step in between the wiring region and the functional member regionmay be small. Thereby, it is possible to inhibit an element from beingpeeled off by being hooked. Also, discomfort when a user put on anelectronic device provided with the stretchable circuit substrate can bereduced.

The second stretch controlling part may have uniform deformationproperties, and may be configured so as to show different deformationproperties depending on positions. For example, when the second stretchcontrolling part has a uniform thickness, it may have uniformdeformation properties. Also, the second stretch controlling part mayinclude a first part, and a second part having higher deformationproperties than that of the first part; in this case, the second stretchcontrolling part may be configured so as to show different deformationproperties depending on positions. For example, in examples shown inFIGS. 17A and 17B, the second stretch controlling part 42 includes thefirst part 42 a, and the second part 42 b having higher deformationproperties than that of the first part 42 a, and the second part 42 b ispositioned in the wiring region 21 side with respect to the first part42 a. Incidentally, FIG. 17A is a cross-sectional view illustrating thestretchable circuit substrate in a stretched state, and FIG. 17B is across-sectional view illustrating the stretchable circuit substrateshown in FIG. 17A in a relaxed state.

The thickness of the second part in the second stretch controlling partmay be thinner than the thickness of the first part. Also, the thicknessof the second part may be, at least partially, reduced gradually towardsthe wiring region side. In the example shown in FIG. 17A, the thicknessof the second part 42 b in the second stretch controlling part 42 ismonotonously reduced gradually from the first part 42 a side toward thewiring region 21 side. In this case, the deformation properties of thefunctional member surrounding region 23 in the base material 2 would behigher along with the direction towards the wiring region 21.Accordingly, it is possible to inhibit the deformation properties of thebase material 2 from dramatically changing in the border between thefunctional member region 22 and the wiring region 21, or near thatregion. Thus, as shown in FIG. 7B, a deformation that matches thebellows-like member appears in the wiring region 21 may be generated inthe base material 2 and the wiring 4 positioned in the functional memberregion 23 when the stretchable circuit substrate 1 is relaxed. Thereby,it is possible to inhibit the damage of the wiring in the border betweenthe functional member region and the wiring region or near that region.

The second stretch controlling part 42 may, for example, have a shape ofhemisphere that covers the entire region of the functional member 5positioned in the functional member region 22 as shown in FIGS. 18A and18B. In this case, the second part 42 b positioned in the wiring region21 side with respect to the first part 42 a in the second stretchcontrolling part 42 would have a thickness which is gradually reducedtowards the wiring region 21 side. Accordingly, the deformationproperties of the functional member surrounding region in the basematerial would be gradually higher towards the wiring region. Thus, itis possible to inhibit the deformation properties of the base materialfrom dramatically changing in the border between the functional memberregion and the wiring region, or near that region. Thereby, it ispossible to inhibit the damage of the wiring in the border between thefunctional member region and the wiring region or near that region.

In the second stretch controlling part, for example, as shown in FIG.18C, the density distribution of the second part 42 b in the secondstretch controlling part 42 may be smaller than the density distributionof the first part 42 a in the second stretch controlling part 42. Thesecond part 42 b includes a plurality of members arranged with a spacebetween each other as shown in FIG. 18C. The density distribution of thesecond part 42 b may be gradually reduced towards the wiring region 21.For example, the width of the plurality of members configuring thesecond part may be gradually reduced towards the wiring region, and thespace between the plurality of members configuring the second part maygradually increase towards the wiring region. Each member of the secondpart may be, for example, configured by the same material as that of thefirst part.

In this case, the deformation properties of the functional membersurrounding region in the base material gradually increases towards thewiring region. Accordingly, it is possible to inhibit the deformationproperties of the base material from dramatically changing in the borderbetween the functional member region and the wiring region, or near thatregion. Thereby, it is possible to inhibit the damage of the wiring inthe border between the functional member region and the wiring region ornear that region.

Incidentally, the first part of the second stretch controlling part mayalso include a plurality of members arranged with a space between eachother.

Also, when the stretchable circuit substrate of the present embodimentcomprises the supporting base material between the base material and thewiring, the second part in the second stretch controlling part may beconfigured as a space part between the supporting base material and thebase material. In this case, the first part in the second stretchcontrolling part is configured by a member that can function as anadhesive for adhering the supporting base material to the base material.The deformation properties of the second part are higher than thedeformation properties of the first part since no member is present inthe second part. Thus, the deformation properties of the functionalmember surrounding region in the base material gradually increasestowards the wiring region. Accordingly, it is possible to inhibit thedeformation properties of the base material from dramatically changingin the border between the functional member region and the wiringregion, or near that region. Thereby, it is possible to inhibit thedamage of the wiring in the border between the functional member regionand the wiring region or near that region.

In the second stretch controlling part, the Young's modulus of thesecond part in the second stretch controlling part may be smaller thanthe Young's modulus of the first part in the second stretch controllingpart. In this case, the deformation properties of the functional membersurrounding region in the base material gradually increase towards thewiring region. Accordingly, it is possible to inhibit the deformationproperties of the base material from dramatically changing in the borderbetween the functional member region and the wiring region, or near thatregion. Thereby, it is possible to inhibit the damage of the wiring inthe border between the functional member region and the wiring region ornear that region.

Also, when the stretchable circuit substrate of the present embodimentcomprises the supporting base material between the base material and thewiring, and when the second stretch controlling part is positionedbetween the supporting base material and the base material, the secondstretch controlling part may be configured so as the Young's modulus ofthe second part in the second stretch controlling part becomes smallerthan the Young's modulus of the first part. In this case, the secondstretch controlling part may be configured by a member that can functionas an adhesive for adhering the supporting base material to the basematerial.

The second stretch controlling part 42 may, as shown in FIG. 18D, leanon the functional member 5. In this case, when the ridge of thebellows-like member arranged in the second stretch controlling part isabout to be made shifted further to the functional member region 22side, the second stretch controlling part 42 leaned onto the functionalmember 5 would be compressed and a repulsive force would occur.Accordingly, it is possible to inhibit the enlargement of the height ofthe ridge in the bellows-like member where the second stretchcontrolling part is arranged. Thereby, the damage of the electronicallyconnected part between the functional member and the wiring can beinhibited. Incidentally, the second stretch controlling part 42 may, asshown in FIG. 18D, lean on the functional member 5 indirectlyinterposing other members such as the other second stretch controllingpart, and although not illustrated, may directly lean on the functionalmember.

The second stretch controlling part may be positioned on the firstsurface side of the base material, may be positioned on the secondsurface side of the base material, and may be positioned inside the basematerial.

When the second stretch controlling part is positioned on the firstsurface side of the base material, the second stretch controlling part42 may be, for example, positioned on the surface of the wiring 4 whichis opposite side surface to the base material 2 side surface as shown inFIG. 10B, and may be positioned between the base material 2 and thewiring 4 as shown in FIG. 19A. When the second stretch controlling partis positioned between the base material and the wiring, the secondstretch controlling part may be positioned on the first surface of thebase material, and may be positioned in the concave part designed in thefirst surface of the base material. Also, when the stretchable circuitsubstrate of the present embodiment comprises the supporting basematerial between the base material and the wiring, the second stretchcontrolling part may be positioned on the surface of the wiring which isopposite side surface to the supporting base material side, and may bepositioned between the supporting base material and the wiring.

When the second stretch controlling part is positioned inside the basematerial, for example, as shown in FIG. 19B, the second stretchcontrolling part 42 is embedded inside the base material 2. Such a basematerial and a second stretch controlling part may be obtained by, forexample, injecting the second stretch controlling part at an appropriatetiming into a mold when the base material is fabricated by pouring aresin into the mold and the resin in the mold is solidified.

When the second stretch controlling part is positioned on the secondsurface side of the base material, the second stretch controlling part42 may be, for example, configured separately from the base material asshown in FIG. 19C, and may be configured integrally as shown in FIGS.19D and 19E. When the second stretch controlling part is configuredintegrally with the base material, the second stretch controlling part42 may be, for example, a convex part protruded from the second surface2 b of the base material 2 as shown in FIG. 19E, and may be the one thatappears in the functional member surrounding region 23 when a concavepart is formed in the wiring region 21 around the functional membersurrounding region 23 as shown in FIG. 19D. Incidentally, “integrally”means that there is no interface between the base material and thesecond stretch controlling part.

Incidentally, the position of the second stretch controlling part in thenormal direction of the first surface in the base material may be sameas or different from the position of the first stretch controlling partin the normal direction of the first surface in the base material.

The second stretch controlling part is positioned at least in thefunctional member surrounding region, and is preferably extended to theborder between the functional member surrounding region and thefunctional member region. For example, as shown in FIG. 10B, the secondstretch controlling part 42 may be extended to the functional memberregion 22 exceeding the border between the functional member surroundingregion 23 and the functional member region 22, and may be extendedfurther to the entire region of the functional member region 22. Also,for example, as shown in FIG. 20A, the second stretch controlling part42 may have a flame shape pattern that extends to follow the borderbetween the functional member surrounding region 23 and the functionalmember region 22.

Also, the second stretch controlling part may include different patternsthat vary with positions. For example, as shown in FIG. 20B, the secondstretch controlling part 42 positioned in the functional member region22 may have a square shape, and the second stretch controlling part 42positioned in the functional member surrounding region 23 may have acircle shape. Incidentally, in the example shown in FIG. 20B, the firststretch controlling part 41 has a rectangular shape.

The functional member surrounding region is a region positioned tosurround the functional member region. The functional member surroundingregion is preferably a region in which the second stretch controllingpart or the adjustment layer is arranged to inhibit stress concentrationin the border between the functional member and the wiring. The size ofthe functional member surrounding region may be determined so as toinhibit stress concentration in the border between the functional memberand the wiring.

The area of the functional member surrounding region may be, forexample, ¼ or more of the area of the functional member region, and maybe ½ or more of the area of the functional member region. Also, the areaof the functional member surrounding region may be, for example, equalto or less than the area of the functional member region, and may be ¾or less of the area of the functional member region.

The functional member surrounding region may be determined as a regionin a certain distance from the edge of the functional member. Thefunctional member surrounding region may be, for example, a region in 5mm from the edge of the functional member, and may be a region in 2 mm.

Incidentally, in the functional member region, an additional memberwhich is different from the second stretch controlling part may bearranged to inhibit the deformation of the functional member region.

8. Reinforcement Member

The stretchable circuit substrate of the present embodiment preferablycomprises a reinforcement member in the position that overlaps thefunctional member region at least in a plan view. In FIG. 21, thestretchable circuit substrate is provided with reinforcement member 8 inthe position overlaps the functional member region 22 at least in a planview.

The reinforcement member 8 has a Young's modulus larger than the Young'smodulus of the base material 2. The Young's modulus of the reinforcementmember 8 is, for example, 1 GPa or more, and is more preferably 10 GPaor more. The Young's modulus of the reinforcement member 8 may be 100times or more of the Young's modulus of the base material 2, and may be1000 times or more thereof. Such a reinforcement member 8 is arranged onthe base material 2, and thus it is possible to inhibit the part of thebase material 2 overlapping the reinforcement member 8 from beingstretched. The Young's modulus of the reinforcement member 8 may be 500GPa or less. Also, the Young's modulus of the reinforcement member 8 maybe 500000 times or less of the Young's modulus of the base material 2.The method for calculating the Young's modulus of the reinforcementmember 8 is the same as the case for the base material 2.

Also, the reinforcement member 8 has bending rigidity larger than thebending rigidity of the base material 2. The bending rigidity of thereinforcement member 8 may be 100 times or more of the bending rigidityof the base material 2, and may be 1000 times or more thereof.

Examples of the material configuring the reinforcement member 8 mayinclude a metal layer containing a metal material, general thermoplasticelastomers, acrylic, urethane-based, epoxy-based, polyester-based,vinylether-based, polyen-thiol-based, and silicone-based oligomers andpolymers. Examples of the metal material may include copper, aluminium,and stainless steel. The thickness of the reinforcement member 8 is, forexample, 10 μm or more.

In the example shown in FIG. 21, the reinforcement member 8 is embeddedinside the base material 2. However, the position of the reinforcementmember is arbitrary as long as the part of the base material 2 thatoverlaps the reinforcement member can be inhibited from stretching. Forexample, the reinforcement member 8 may be positioned on the secondsurface 2 b side of the base material 2, and may be positioned on thefirst surface 2 a side of the base material 2. Also, when thestretchable circuit substrate is provided with the supporting basematerial, the reinforcement member may be positioned on the firstsurface side of the supporting base material, and may be positioned onthe second surface side of the supporting base material. Incidentally,the first surface and the second surface of the supporting base materialrespectively signify the same direction side surface as the firstsurface and the second surface of the base material.

In the example shown in FIG. 21, the reinforcement member 8 extends fromthe position where it overlaps the functional member 5 in the planedirection of the first surface 2 a of the base material 2, to the wiring4 side with respect to the edge 51 of the functional member 5. It meansthat the reinforcement member 8 is preferably positioned in the borderbetween the functional member surrounding region and the functionalmember region in a plan view. In descriptions below, a region thatoverlaps the reinforcement member 8 when viewed along with the normaldirection of the first side surface 2 a of the base material 2, may bealso referred to as reinforcement member region 81. Also, a regionpositioned surrounding the reinforcement member region 81 may be alsoreferred to as reinforcement surrounding region 82. Also, a regionincluding the reinforcement member region 81 and the reinforcementsurrounding region 82 may be also referred to as a reinforcement region.

When the stretchable circuit substrate is provided with thereinforcement member 8, when the base material 2 stretches, stress wouldbe concentrated at apart of the stretchable circuit substrate thatoverlaps the reinforcement member 8, which is the border between thereinforcement member region 81 and the reinforcement surrounding region82. In consideration of this point, as shown in FIG. 21, it ispreferable that the second stretch controlling part 42 is arranged inthe reinforcement surrounding region 82, and also, the second stretchcontrolling part 42 extends to the border between the reinforcementsurrounding region 82 and the reinforcement member region 81. Thereby,damage in members such as the wiring 4 in the border between thereinforcement member region 81 and the reinforcement member surroundingregion 82 can be inhibited.

The size of the reinforcement surrounding region 82 may be determined soas to inhibit the stress concentration in the border between thereinforcement member region 81 and the reinforcement surrounding region82. For example, the area of the reinforcement surrounding region 82 is¼ or more of the area of the reinforcement member region 81, and may be½ or more of the area of the reinforcement member region 81. Also, thearea of the reinforcement surrounding region 82 is, for example, equalto or less than the area of the reinforcement member region 81, and maybe ¾ or less of the area of the reinforcement member region 81.

The reinforcement surrounding region 82 may be determined as a region ina certain distance from the edge of the reinforcement member region 81.For example, the reinforcement surrounding region 82 may be, from theedge of the reinforcement member region 81, a region within 5 mm, andmay be a region within 2 mm.

Incidentally, FIG. 21 shows an example where the second stretchcontrolling part 42 overlaps the entire region of the reinforcementmember region 81, but the embodiment is not limited thereto. Theposition of the second stretch controlling part 42 is arbitrary as longas the second stretch controlling part 42 arranged in the reinforcementsurrounding region 82 extends to the border between the reinforcementsurrounding region 82 and the reinforcement member region 81. Forexample, as shown in FIG. 22, the second stretch controlling part 42arranged in the reinforcement surrounding region 82 may not overlap theentire region of the reinforcement member region 81. In this case, thesecond stretch controlling part 42 may overlaps at least a part of thereinforcement member 8. For example, as shown in FIG. 22, the secondstretch controlling part 42 may not overlap the functional member 5, butmay partially overlap the reinforcement member 8; or although notillustrated, the second stretch controlling part 42 may partiallyoverlap the functional member 5 and the reinforcement member 8.

Also, as shown in FIG. 23A, it is preferable that the adjustment layer 3is positioned in the border between the reinforcement member region 81and the reinforcement surrounding region 82 in a plan view. In otherwords, it is preferable that the adjustment layer 3 is positioned so asto straddle the border between the reinforcement member region 81 andthe reinforcement surrounding region 82. When the base material 2stretches, stress easily concentrates in the border between thereinforcement member region 81 and the reinforcement surrounding region82. In more specific, the border is, for example, a border between ahard region where the reinforcement member is present (reinforcementmember region) and a region where the reinforcement member is notpresent (reinforcement surrounding region); thus, stress easilyconcentrates in the border. Whereas, the adjustment layer 3 ispositioned in the border between the reinforcement member region 81 andthe reinforcement surrounding region 82 in a plan view, and thus thestress may be dispersed. In this manner, the adjustment layer 3 ispreferably positioned so as to straddle the edge of the reinforcementmember. Also, as shown in FIG. 23B, the adjustment layer 3 is preferablypositioned in the border between the functional member region 22 and thefunctional member surrounding region 23 in a plan view. In other words,it is preferable that the adjustment layer 3 is positioned so as tostraddle the border between the functional member region 22 and thefunctional member surrounding region 23. When the base material 2stretches, stress easily concentrates in the border between thefunctional member region 22 and the functional member surrounding region23. In more specific, the border is, for example, a border between ahard region including the functional member and a material such as aresin of potting agent that covers the functional member (functionalmember region) and a soft region not including these (functional membersurrounding region); thus, the stress easily concentrates in the border.Whereas, the adjustment layer 3 is positioned in the border between thefunctional member region 22 and the functional member surrounding region23 in a plan view, and thus the stress may be dispersed. In this manner,it is preferable that the adjustment layer 3 is positioned so as tostraddle the edge of the functional member, or the edge of the resin ofa material such as a potting agent that covers the functional member.Further, as shown in FIG. 23C, the adjustment layer 3 may be positionedbetween the base material 2 and the wiring 4. The adjustment layer 3 maybe positioned on the base material 2 side surface of the wiring 4, andmay be positioned on the surface of the wiring 4 which is opposite sidesurface to the base material 2 side surface.

Also, as shown in FIG. 24, in the stretchable circuit substrate of thepresent embodiment, cross wiring 14 that layers the wiring 4 interposinginsulating layer 9 may be further arranged in addition to the wiring 4.The cross wiring 14 is, for example, a wiring configuring an electronicpart. The cross wiring 14 extends so as to cross the wiring 4 in a planview. The insulating layer 9 is arranged between the wiring 4 and thecross wiring 14 and thus occurrence of short circuit between the crosswiring 14 and the wiring 4 can be inhibited. Examples of the materialconfiguring the insulating layer 9 may include an organic resin such aspolyimide, acryl, urethane, and epoxy resins, and an inorganic materialsuch as SiO₂ and alumina. Also, although not illustrated in particular,the reinforcement member is preferably arranged so as to include atleast an overlapping part of the wiring 4 and the cross wiring 14 in aplan view. Thereby, occurrence of short circuit between the wiring 4 andthe cross wiring 14 due to deterioration of insulating properties or acrack in the insulating layer 9 can be inhibited when stress such asexpansion and bend is applied to the stretchable circuit substrate.

9. Pressure Sensitive Adhesive Layer

The stretchable circuit substrate of the present embodiment may comprisea pressure sensitive adhesive layer on the surface of the wiring, thefunctional member, and the adjustment layer, which is opposite sidesurface to the base material side surface, or on the second surface sideof the base material. The pressure sensitive adhesive layer is arrangedto attach the stretchable circuit substrate of the present embodiment toa targeted object such as a human body.

The pressure sensitive adhesive is usually arranged after a member suchas the wiring including the bellows-like member is formed; thus, doesnot include the bellows-like member.

The pressure sensitive adhesive layer is not particularly limited andgeneral pressure sensitive adhesives may be used, and is appropriatelyselected depending on factors such as applications of the stretchablecircuit substrate. Examples thereof may include an acrylic pressuresensitive adhesive, a silicone-based pressure sensitive adhesive, aurethane-based pressure sensitive adhesive, and a rubber-based pressuresensitive adhesive.

The thickness of the pressure sensitive adhesive layer may be athickness which is stretchable and with which the stretchable circuitsubstrate can be attached to a targeted object, and is appropriatelyselected depending on factors such as applications of the stretchablecircuit substrate. The thickness of the pressure sensitive adhesivelayer may be, for example, in a range of 10 μm or more and 100 μm orless.

Also, a release layer may be positioned on the surface of the pressuresensitive adhesive layer which is opposite side surface to the basematerial side surface. As the release layer, general ones may be used.

Examples of a method for arranging the pressure sensitive adhesive layermay include a method of coating a pressure sensitive adhesive, and amethod in which a pressure sensitive adhesive film having a pressuresensitive adhesive layer on one surface of the release layer is preparedand the pressure sensitive adhesive layer side of the pressure sensitiveadhesive film is attached.

10. Method for Producing Stretchable Circuit Substrate

The stretchable circuit substrate of the present embodiment may befabricated by a method in which the stretchable circuit substrate isexpanded in advance.

The method for producing the stretchable circuit substrate of thepresent embodiment may comprise: for example, an expanding step ofexpanding a base material being stretchable; a wiring arranging step ofarranging a wiring on the first surface side of the base material in astate the base material being expanded; an adjustment layer arrangingstep of arranging the adjustment layer on the first surface side of thebase material in the state the base material being expanded; and areleasing step of removing tensile stress to the base material after thewiring arranging step and the adjustment layer arranging step. Thewiring arranging step and the adjustment layer arranging step may beconducted in no particular order.

FIGS. 25A to 25E are process diagrams illustrating an example of themethod for producing the stretchable circuit substrate of the presentembodiment. First, as shown in FIGS. 25A and 25B, the base material 2being stretchable is expanded. It may be also said that this step is topre-stretch the base material being stretchable. Next, as shown in FIG.25C, the adjustment layer 3 is arranged on the first surface 2 a of thebase material 2, in the state the base material 2 being expanded.Sequentially, as shown in FIG. 25D, the wiring 4 and the functionalmember 5 are arranged on the adjustment layer 3. Sequentially, as shownin FIG. 25E, tensile stress to the base material 2 is removed. On thisoccasion, the adjustment layer 3 and the wiring 4 change their forms tohave the bellows-like member, along with the contraction of the basematerial 2 being stretchable. In this manner, the stretchable circuitsubstrate 1 may be obtained. In the example shown in FIGS. 25A to 25E,the adjustment layer arranging step and the wiring arranging step areconducted in this order.

FIGS. 26A to 26E are process diagrams illustrating an additional exampleof the method for producing the stretchable circuit substrate of thepresent embodiment. First, as shown in FIG. 26A, the adjustment layer 3is arranged on one surface of the supporting base material 7, and thewiring 4 and the functional member 5 are arranged on the adjustmentlayer 3 to fabricate a laminate. Also, as shown in FIGS. 26B to 26C, thebase material 2 being stretchable is expanded. Next, as shown in FIG.26D, the supporting base material 7 side surface of the laminate isattached to the first surface 2 a of the base material 2 interposing theadhesive layer 6 in the state the base material 2 being expanded.Sequentially, as shown in FIG. 26E, tensile stress to the base material2 is removed. On this occasion, the adjustment layer 3, the wiring 4,and the supporting base material 7 change their forms to have thebellows-like member along with the contraction of the base material 2being stretchable. In this manner, the stretchable circuit substrate 1may be obtained. In the example shown in FIGS. 26A to 26E, theadjustment layer arranging step and the wiring arranging step aresimultaneously conducted.

In the expanding step, when the base material is to be expanded, forexample, it may be expanded to uniaxial direction and may be expanded tobiaxial direction.

In the expanding step, the base material is, on the basis of the normalstate (non-stretched state), preferably expanded 20% (1.2 times of theinitial length) or more, more preferably expanded 30% (1.3 times of theinitial length) or more, and further preferably expanded 50% (1.5 timesof the initial length) or more. Incidentally, the upper limit of theexpansion rate of the base material is approximately 200%. The basematerial is expanded in the above described range and thus a stretchablewiring may be obtained.

The method for producing the stretchable circuit substrate of thepresent embodiment may comprise, after the expanding step as well asbefore the releasing step, a first stretch controlling part arrangingstep of arranging the first stretch controlling part on the firstsurface side of the base material or the second surface side of the basematerial in the state the base material being expanded, and a secondstretch controlling part arranging step of arranging the second stretchcontrolling part on the first surface side of the base material or thesecond surface of the base material in the state the base material beingexpanded. In this case, the wiring arranging step, the adjustment layerarranging step, the first stretch controlling part arranging step, andthe second stretch controlling part arranging step may be conducted inno particular order.

Also, when the first stretch controlling part and the second stretchcontrolling part are embedded inside the base material of thestretchable circuit substrate in the present embodiment, as describedabove, a base material including the first stretch controlling part andthe second stretch controlling part inside in advance may be obtained.

Also, the method for producing the stretchable circuit substrate of thepresent embodiment may comprise a pressure sensitive adhesive layerarranging step of arranging the pressure sensitive adhesive layer afterthe releasing step.

Also, the stretchable circuit substrate of the present embodiment maycomprise a supporting body on the surface of the base material which isopposite side surface to the wiring. Further, it may comprise thepressure sensitive adhesive layer between the base material and thesupporting body. FIGS. 27A and 27B are process diagrams illustrating anadditional example of the method for producing the stretchable circuitsubstrate of the present embodiment. As shown in FIG. 27A, laminate 100after the releasing step, pressure sensitive adhesive layer 110, andsupporting body 120 are arranged in this order, and as shown in FIG.27B, these members are integrated to obtain stretchable circuitsubstrate 1 further comprising the pressure sensitive adhesive layer 110and the supporting body 120. The supporting body preferably isstretchable. Examples of the material for the supporting body mayinclude a rubber, a resin, a fabric, and a metal. Incidentally, thepressure sensitive adhesive included in the pressure sensitive adhesivelayer is as described above, but materials such as anethylene-vinylacetate copolymer (EVA), an olefin-based pressuresensitive adhesive, a polyamide-based pressure sensitive adhesive, and apolyesterurethane-based adhesive may be further used. Examples of themethod for integrating the laminate after the releasing step, thepressure sensitive adhesive layer, and the supporting body may includeheating, pressurizing, and heat-pressurizing.

11. Applications

The stretchable circuit substrate of the present embodiment isstretchable, and thus may be applied to a curved surface and may followthe deformation. For such advantages, the stretchable circuit substrateof the present embodiment may be used in products such as a wearabledevice, a medical equipment, and a robot.

The stretchable circuit substrate of the present embodiment may be usedby, for example, attaching thereof to a human skin, and may be used byinstalling to a wearable device and a robot. For example, thestretchable circuit substrate of the present embodiment may be used asat least a part of a product that is put on a part of body such as humanarms. The stretchable circuit substrate may be expanded, and thus, forexample, may be put on the body in the state the stretchable circuitsubstrate being expanded for the stretchable circuit substrate to becohered to a part of the body. For this reason, excellent fit may beachieved. Also, it is possible to inhibit the resistance value of thewiring from decreasing when the stretchable circuit substrate isexpanded, and thus excellent electric characteristics of the stretchablecircuit substrate may be achieved. Also, the stretchable circuitsubstrate may be expanded and thus can be arranged to follow a curvedsurface and a three-dimensional shape.

Examples of the applications of the stretchable circuit substrate in thepresent embodiment may include applications to home appliances,applications to home decorations such as to give electronic function toproducts such as curtains and door knobs, applications to beddings suchas to give electronic function to cushions and mattresses, applicationsto food packaging such as to give electronic function to plastic bottlesand wraps, applications to robots, applications to cosmetics such as togive iontophoresis to liquid chemical permeated cosmetic masks andelectronic stimulating shape-up products, and applications to apparelsuch as to give electronic function to products such as hats andclothes. In the present disclosure, an article to be used for any ofthese applications and the article comprising the above describedstretchable circuit substrate may be provided.

Also, examples of the article in which the stretchable circuit substrateof the present disclosure is arranged may include shoes, insoles, masks,socks, stockings, wrist bands, clothes, headbands, gloves, inner wears,sports wears, diapers, hats, scarves, earmuffs, bags (such as backpacks,waist pouches, hand bags, sport bags, and suitcases), glasses, hearingaids, earrings, pierced earrings, necklaces, bracelets, anklets, belts,hair accessories, hair bands, headbands, clocks, collars, rings, falsenails, baby carriages, drones, wheel chairs, swim wears, furniture (suchas sofa, chairs, desks, lightings, doors, flower vases, handrails, beds,mattresses, futon mattresses, cushions, coverlets, blankets/sheets, andluncheon mats), sticking plasters, bandages, liquid chemical packages,tubes, liquid chemical permeated cosmetic masks, compresses, gauzes,tooth brushes, catheters, artificial hands, artificial legs, artificialeyes, contact lenses, supporters, balls, rackets, automobile interiorseats, instrument panels, tires, flags, notes, books, robot hands,robot's exteriors, vital sensors, disposable bio-electrode, pocket bodywarmers, leads, individual ID recognizing deices, helmets, IC tags,batteries, and vinyl houses. Also, additional examples of the article inwhich the stretchable circuit substrate of the present embodiment isarranged may include health care products, sport products, amusementproducts, haptics products such as a vibration actuator device, energymanagement products such as an antenna of wireless electric supply, homeappliance products, furniture and home decorations such as curtains,carpets and sofa, bedding products such as cushions and mattresses,packaging products such as plastic bottles and wraps, stationaryproducts such as books and pens, and mobility-related products such asautomobile interiors and seats. In the present disclosure, an article ofany of these and the article comprising the above described stretchablecircuit substrate may be provided.

B. Second Embodiment

The stretchable circuit substrate of the second embodiment in thepresent disclosure comprises: a base material being stretchable; awiring which is on a first surface side of the base material, and whichincludes a bellows-like member including a plurality of ridges andrecesses arranged in a first direction which is one of in-planedirections in the first surface of the base material; and an adjustmentlayer which includes the bellows-like member and is on the first surfaceside of the base material so as to at least overlaps, in a plan view, awiring region in which the wiring is positioned; wherein the adjustmentlayer has a Young's modulus larger than a Young's modulus of the basematerial.

Here, in the production method of the stretchable circuit substrate,when the wiring changes its form to bellows-like shape, the degree ofchange in form varies with positions due to the factors such as unevenstretch of the base material when it is expanded and difference indistribution density of the metal thin film on the base material. Whenthe degree of change in forms of the wiring is uneven, there may be somecases where the extent of curves and bends appear in the wiring locallyincreases. On the spot where the extent of the curves and the bendsappear in the wiring is locally large, stress concentrates. Also, ingeneral, an elastomer is used in the base material and a material suchas a metal and an alloy is used in the wiring; thus, the Young's modulusof the wiring is extremely larger than the Young's modulus of the basematerial. In other words, the wiring is harder than the base materialand thus difficultly changes its form. For that reason, on the spotwhere the extent of the curves and the bends appear in the wiring islocally large, stress easily concentrates. On the spot where stressconcentrates in the wiring, fractures such as bent may be generated, andthe resistance value may increase when the stretchable circuit substrateis repeatedly stretched as well.

Whereas, in the present embodiment, an adjustment layer having a largerYoung's modulus than that of the base material is positioned in thewiring region of the first surface side of the base material, and thusstress concentration on the wiring due to the difference in Young'smodulus between the base material and the wiring can be inhibited.Accordingly, even when the extent of curves and bends appear in thewiring locally increases, stress concentration on the spot where theextent of the curves and the bends appear in the wiring is locally largecan be reduced. Thereby, the fracture of the wiring and the increase inthe resistance value of the wiring when the stretchable circuitsubstrate is repeatedly stretched can be inhibited.

Incidentally, the base material being stretchable, the wiring, thefunctional member, the supporting base material, the first stretchcontrolling part, the second stretch controlling part, the pressuresensitive adhesive layer, and the method for producing the stretchablecircuit substrate are the same as those of the stretchable circuitsubstrate in the first embodiment above; thus, the descriptions hereinare omitted. Below, the adjustment layer of the stretchable circuitsubstrate in the present embodiment will be described.

<Adjustment Layer>

The adjustment layer in the present embodiment is a member typicallypositioned on the first surface side of the base material, as well as inthe wiring region; includes a bellows-like member in which ridges andrecesses in the normal direction of the first surface in the basematerial continuously appear along with the in-plane direction of thefirst surface in the base material; and has a Young's modulus largerthan that of the base material.

The Young's modulus of the adjustment layer is larger than the Young'smodulus of the base material. Also, the Young's modulus of theadjustment layer is preferably equal to or less than the Young's modulusof the wiring. The reason therefor is because stress concentration canbe reduced when the adjustment layer having the Young's modulus largerthan the Young's modulus of the base material and equal to or less thanthe Young's modulus of the wiring is positioned in the wiring region ofthe first surface side of the base material.

Incidentally, other points of the adjustment layer may be the same asthose in the stretchable circuit substrate of the first embodimentdescribed above.

The present disclosure is not limited to the above-describedembodiments. The above-describe embodiments are examples, and everythinghaving a composition that is substantially the same as the technicalconcept disclosed in the Scope of Claims of the present disclosure andhaving the same efficacy are included within the technical scope of thepresent disclosure.

EXAMPLES

Below, examples and comparative examples are shown and the presentdisclosure is described in greater detail.

Example 1

<Fabrication of Stretchable Base Material>

A pressure sensitive adhesive sheet (model no. 8146 from 3M) was used asan adhesive layer, two-pack addition-condensation typepolydimethylsiloxane (PDMS) was coated on that pressure sensitiveadhesive sheet so as the thickness became 900 μm, and the PDMS was curedto fabricate a first laminate including the adhesive layer and astretchable base material. Sequentially, a part of the first laminatewas taken out as a sample, and the Young's modulus of the stretchablebase material was measured by a tensile test according to JIS K6251. Asa result, the Young's modulus of the stretchable base material was 0.05MPa. Also, the cross-sectional area of the stretchable base material was0.45*10⁻⁶ m².

<Formation of Wiring and Adjustment Layer>

A polyethylene naphthalate (PEN) film having a thickness of 2.5 μm wasused as a supporting base material, Ag paste was screen-printed on thePEN film, and a wiring having a width of 200 μm and a length of 40 mmwas arranged thereon. Also, apart of the supporting base material wastaken out as a sample, and the Young's modulus of the supporting basematerial was measured by a tensile test according to JIS K6251. As aresult, the Young's modulus of the supporting base material was 2.2 GPa.

Next, a urethane resin was screen-printed in a thickness of 30 μm so asto cover the wiring, and thereby an adjustment layer was formed. In thismanner, a second laminate including the supporting base material, thewiring, and the adjustment layer was obtained. Sequentially, apart ofthe adjustment layer was taken out as a sample, and the Young's modulusof the adjustment layer was measured by a tensile test according to JISK6251. As a result, the Young's modulus of the adjustment layer was 35MPa.

Here, the magnitude relations of the Young's modulus of the PDMSstretchable base material, PEN supporting base material, the Ag wiring,and the urethane resin adjustment layer were as follows:

stretchable base material<adjustment layer<wiring<supporting basematerial.

<Fabrication of Stretchable Circuit Substrate>

The supporting base material side surface of the second laminate wasattached to the adhesive layer side surface of the first laminate in thestate the first laminate was uniaxially expanded 50%. The resistance ofthe wiring on this occasion was 35Ω.

Next, the expansion was released to contract the stretchable basematerial. Thereby, a concave and convex shape was generated on thesurface of the supporting base material and the contraction was caused.On this occasion, the average of 5 periods therein was 620 μm, and theminimum radius of curvature was 45 μm. Also, the resistance of thewiring was 39Ω, and almost no change was seen.

Comparative Example 1

A first laminate and a second laminate were fabricated in the samemanner as in Example 1 except that the urethane resin adjustment layerwas not arranged on the supporting base material. Next, in the samemanner as in Example 1, the supporting base material side of the secondlaminate was attached to the adhesive layer side surface of the firstlaminate in the state the first laminate was uniaxially expanded 50%.The resistance of the wiring on this occasion was 47Ω.

Next, the expansion was released to contract the stretchable basematerial. Thereby, a concave and convex shape was generated on thesurface of the supporting base material, and the contraction was caused.On this occasion, the average of 5 periods therein was 420 μm, thestandard deviation of the period was 67 μm, and the minimum radiuscurvature was 2 μm. Uneven wrinkles and the bend of the wiring wereconfirmed in the part of the concave and convex shape. Also, theresistance of the wiring was 81Ω, which was the resistance rise in twotimes or more.

Example 2

<Fabrication of Stretchable Base Material>

A pressure sensitive adhesive sheet (model no. 8146 from 3M) was used asan adhesive layer, two-pack addition-condensation typepolydimethylsiloxane (PDMS) was coated on that pressure sensitiveadhesive sheet, and the PDMS was cured to fabricate a first laminateincluding the adhesive layer and a stretchable base material.

<Formation of Wiring and Adjustment Layer>

A polyethylene naphthalate (PEN) film having a thickness of 2.5 μm wasused as a supporting base material, and a copper layer having athickness of 1 μm was formed on the PEN film using a vapor depositionmethod. Sequentially, the copper layer was processed using aphotolithography method and an etching method. Thereby, a wiring havinga width of 200 μm and a length of 40 mm was obtained.

Next, a urethane resin was screen-printed in a thickness of 30 μm so asto cover the wiring to form an adjustment layer. Thereby, a secondlaminate including the supporting base material, the wiring, and theadjustment layer was obtained.

Here, the magnitude relations of the Young's modulus of the PDMSstretchable base material, the PEN supporting base material, the Cuwiring, and the urethane resin adjustment layer were as follows:stretchable base material (0.05 MPa)<adjustment layer (35MPa)<supporting base material (520 MPa)<wiring (7500 MPa).

<Fabrication of Stretchable Circuit Substrate>

The supporting base material side surface of the second laminate wasattached to the adhesive layer side surface of the first laminate in thestate the first laminate was uniaxially expanded 50%. The resistance ofthe wiring on this occasion was 7.7Ω.

Next, the expansion was released to contract the stretchable basematerial. Thereby, a concave and convex shape was generated on thesurface of the base material, and the contraction was caused. On thisoccasion, the average of 5 periods therein was 794 μm, and the minimumradius curvature was 51 μm. Also, the resistance of the wiring was 7.6Ω,and almost no change was seen.

Next, when the stretchable circuit substrate was continuously expanded100,000 times in the direction to which the wiring extends, in an amountof 30% when the amount of post-contraction was 100%, the resistancevalue was 1.03 times which did not almost change.

Also, when a glass substrate (OA10G from Nippon Electric Glass Co.,Ltd.; thickness of 0.7 mm) was disposed on the base material side of thestretchable circuit substrate, and in that state, it washeat-pressurized for 10 seconds at 120° C. and approximately 10 kPa/cm²,the disorder in the shape of bellows was not seen.

Comparative Example 2

A first laminate and a second laminate were fabricated in the samemanner as in Example 2, except that the urethane resin adjustment layerwas not arranged on the supporting base material. Next, in the samemanner as in Example 2, the supporting base material side surface of thesecond laminate was attached to the adhesive layer side surface of thefirst laminate in the state the first laminate was uniaxially expanded50%. The resistance of the wiring on this occasion was 7.5Ω.

Next, the expansion was released to contract the stretchable basematerial. Thereby, a concave and convex shape was generated on thesurface of the supporting base material, and the contraction was caused.On this occasion, the average of 5 periods therein was 158 μm and theminimum radius curvature was 10 μm. Uneven wrinkles and the bend of thewiring were confirmed in the part of the concave and convex shape. Also,the resistance of the wiring was 7.6Ω, and no resistance rise was seen;however, when the stretchable circuit substrate was continuouslystretched in the direction to which the wiring extends in an amount of30% when the amount of post-contraction was 100%, the wiring was cut atthe 3000^(th) time.

Also, when a glass substrate (OA10G from Nippon Electric Glass Co.,Ltd.; thickness of 0.7 mm) was disposed on the base material side of thestretchable circuit substrate, and in that state, it washeat-pressurized for 10 seconds at 120° C. and approximately 10 kPa/cm²,the shape of the bellows was smashed to form a trapezoid, and the cut ofthe wiring occurred.

Example 3

<Fabrication of Stretchable Base Material>

A first laminate including an adhesive layer and a stretchable basematerial was fabricated in the same manner as in Example 2.

<Formation of Wiring and Adjustment Layer>

A second laminate including a supporting base material, a wiring, and anadjustment layer was obtained in the same manner as in Example 2.Incidentally, as the wiring in the second laminate, a wiring having apair of electrodes was formed. Next, a resistance chip (0Ω) having asize of 1.0 mm by 0.5 mm was mounted between the pair of electrodesusing a solder. As the solder, TB48N742 from KOKI Company Ltd. was used.

<Fabrication of Stretchable Circuit Substrate>

The supporting base material side surface of the second laminate wasattached to the adhesive layer side surface of the first laminate in thestate the first laminate was uniaxially expanded 50%. The resistance ofthe wiring on this occasion was 6.7Ω.

Next, the expansion was released to contract the stretchable basematerial. Thereby, a concave and convex shape was generated on thesurface of the supporting base material, and the contraction was caused.The resistance of the wiring was 6.6Ω. Also, when the stretchablecircuit substrate was continuously stretched in the direction to whichthe wiring extends in an amount of 30% when the amount of thepost-contraction was 100%, the wiring was cut at the 1400^(th) time.

Example 4

A stretchable circuit substrate was fabricated in the same manner as inExample 3, except that an adjustment layer having a donut shape havingan outer diameter of 12 mm by 6 mm and an inner diameter of 2 mm by 1 mmwas further layered on the functional member surrounding region aroundthe resistance chip. The resistance of the wiring was 6.5Ω. Also, whenthe stretchable circuit substrate was continuously expanded in thedirection to which the wiring extended in an amount of 30% when thepost-contraction was 100%, the wiring was cut at the 2700^(th) time.

Comparative Example 3

A stretchable circuit substrate was fabricated in the same manner as inExample 3, except that the adjustment layer was not formed. Theresistance of the wiring was 6.7Ω. Also, when the stretchable circuitsubstrate was continuously stretched in the direction to which thewiring extended in an amount of 30% when the post-contraction was 100%,the wiring was cut at the 300^(th) time.

Example 5

As a stretchable circuit substrate, one wherein a wiring and areinforcement member were arranged on the first surface side of the basematerial was fabricated.

<Fabrication of Stretchable Base Material>

As an adhesive layer, a pressure sensitive adhesive sheet 814 (from 3M)was prepared. Sequentially, a polyimide film (UPILEX™ from UbeIndustries Ltd.; thickness of 125 μm) having a size of 5 mm by 5 mm wasarranged on the pressure sensitive adhesive sheet as a reinforcementmember. Sequentially, two-pack addition-condensation typepolydimethylsiloxane (hereinafter referred to as PDMS) as a basematerial was coated on the side where the reinforcement member wasarranged on the adhesive layer so as the thickness becomes approximately1 mm and the reinforcement member was buried, and cured. Thereby, afirst laminate including the adhesive layer, the reinforcement member,and a stretchable base material was fabricated. In the first laminate,the reinforcement member is buried in the first surface side of the basematerial, and the adhesive layer is arranged on the first surface of thebase material.

<Formation of Wiring and Adjustment Layer>

A polyethylene naphthalate (PEN) film having a thickness of 2.5 μm wasused as a supporting base material, and a copper layer having athickness of 1 μm was formed on the PEN film using a vapor depositionmethod. Sequentially, the copper layer was processed using aphotolithography method and an etching method. Thereby, a wiring (wiringincluding a pair of electrodes) having a width of 200 μm and a length of40 mm was obtained.

Next, a urethane resin was screen-printed in a thickness of 30 μm so asto cover the wiring to form an adjustment layer. On this occasion, forexample, as shown in FIG. 23A, the adjustment layer 3 was formed so asto straddle the border between the reinforcement member region 81 andthe reinforcement surrounding region 82 in a plan view. Thereby, asecond laminate including the supporting base material, the wiring, andthe adjustment layer was obtained. Next, a resistance chip (0Ω) having asize of 1.0 mm by 0.5 mm was mounted between the pair of electrodesusing a solder. As the solder, TB48N742 from KOKI Company Ltd. was used.

<Fabrication of Stretchable Circuit Substrate>

The supporting base material side surface of the second laminate wasattached to the adhesive layer side surface of the first laminate in thestate the first laminate is uniaxially expanded 50%. On this occasion,the polyimide film (reinforcement member) in the first laminate and theresistance chip in the second laminate were arranged o as to overlapeach other in a plan view.

Next, the expansion was released to contract the stretchable basematerial. Thereby, a concave and convex shape was generated on thesurface of the supporting base material, and the contraction was caused.The resistance of the wiring was 6.6Ω. Also when the stretchable circuitsubstrate was continuously expanded 100,000 times in the direction towhich the wiring extended in an amount of 30% when the post-contractionwas 100%, the resistance value was 1.05 times and it did not almostchange.

Example 6

A stretchable circuit substrate was fabricated in the same manner as inExample 5, except that the adjustment layer was coated on just thereinforcement surrounding region side (wiring region side) in a planview, not to straddle the border between the reinforcement member regionand the reinforcement surrounding region. The resistance of the wiringwas 6.5Ω. Also, when the stretchable circuit substrate was continuouslystretched 100,000 times in the direction to which the wiring extended inan amount of 30% when the post-contraction was 100%, the wiring was cutat the 7000^(th) time. In this manner, it was confirmed that theoccurrence of wiring cut was further inhibited when the adjustment layerwas positioned so as to straddle the border between the reinforcementmember region and the reinforcement surrounding region in a plan view.

REFERENCE SIGNS LIST

1 . . . stretchable circuit substrate

2 . . . base material being stretchable

2 a . . . first surface of base material being stretchable

2 b . . . second surface of base material being stretchable

3 . . . adjustment layer

4 . . . wiring

5 . . . functional member

6 . . . adhesive layer

7 . . . supporting base material

21 . . . wiring region

22 . . . functional member region

23 . . . functional member surrounding region

30 . . . bellows-like member

31, 33, 35 . . . ridge

32, 34, 36 . . . recess

41 . . . first stretch controlling part

42 . . . second stretch controlling part

The invention claimed is:
 1. A stretchable circuit substrate comprising:a base material being stretchable; a wiring which is on a first surfaceside of the base material, and which includes a bellows-like memberincluding a plurality of ridges and recesses arranged in a firstdirection which is one of in-plane directions in the first surface sideof the base material; and an adjustment layer which includes thebellows-like member and is on the first surface side of the basematerial so as to at least overlap, in a plan view, a wiring region inwhich the wiring is positioned; wherein: the adjustment layer has aYoung's modulus smaller than a Young's modulus of the wiring; and ridgesand recesses are included at a part where a second surface positioned atan opposite side to the first surface side of the base material overlapsthe bellows-like member.
 2. The stretchable circuit substrate accordingto claim 1, wherein the adjustment layer has a Young's modulus largerthan a Young's modulus of the base material.
 3. The stretchable circuitsubstrate according to claim 1, wherein the stretchable circuitsubstrate comprises the wiring region and a functional member regionwhich is adjacent to the wiring region and to which a functional memberis mounted; and the adjustment layer is continuously positioned in thewiring region and the functional member region.
 4. The stretchablecircuit substrate according to claim 3, further comprising a functionalmember that is on the first surface side of the base material andpositioned in the functional member region.
 5. The stretchable circuitsubstrate according to claim 1, wherein the wiring includes a terminalpart to be connected to a functional member; and the adjustment layercovers whole the wiring region excluding the terminal part of thewiring, in a plan view.
 6. The stretchable circuit substrate accordingto claim 1, wherein the stretchable circuit substrate comprises thewiring region and a functional member region which is adjacent to thewiring region and to which a functional member is mounted; and theadjustment layer is positioned in a border between the functional memberregion and a functional member surrounding region which is positionedaround the functional member region, in a plan view.
 7. The stretchablecircuit substrate according to claim 1, wherein the stretchable circuitsubstrate comprises the wiring region and a functional member regionwhich is adjacent to the wiring region and to which a functional memberis mounted; the stretchable circuit substrate comprises a reinforcementmember which is positioned so as to at least overlap, in a plan view,the functional member region; and the adjustment layer is positioned ina border between a reinforcement member region where the reinforcementmember is positioned, and a reinforcement surrounding region positionedaround the reinforcement member region.
 8. The stretchable circuitsubstrate according to claim 1, further comprising a supporting basematerial.
 9. The stretchable circuit substrate according to claim 8,wherein the supporting base material has a Young's modulus larger than aYoung's modulus of the base material.
 10. The stretchable circuitsubstrate according to claim 8, comprising a supporting base materialbetween the base material and the wiring.
 11. The stretchable circuitsubstrate according to claim 1, wherein the adjustment layer ispositioned on an opposite side surface to base material side surface ofthe wiring.
 12. The stretchable circuit substrate according to claim 1,wherein the adjustment layer is positioned between the base material andthe wiring.
 13. The stretchable circuit substrate according to claim 1,wherein the stretchable circuit substrate further comprises a supportingbase material between the base material and the wiring; and theadjustment layer is positioned between the supporting base material andthe wiring.
 14. The stretchable circuit substrate according to claim 1,wherein an amplitude of ridges and recesses which appears at a partwhere a second surface positioned at an opposite side to the firstsurface side of the base material overlaps the bellows-like member, issmaller than the amplitude of ridges and recesses which appears at apart where the first surface side of the base material overlaps thebellows-like member.
 15. The stretchable circuit substrate according toclaim 14, wherein the amplitude of ridges and recesses which appears ata part where the second surface positioned at an opposite side to thefirst surface side of the base material overlaps the bellows-likemember, is 0.9 times or less of the amplitude of ridges and recesseswhich appears at a part where the first surface side of the basematerial overlaps the bellows-like member.
 16. The stretchable circuitsubstrate according to claim 1, wherein a cycle of ridges and recesseswhich appears at a part where a second surface positioned at an oppositeside to the first surface side of the base material overlaps thebellows-like member, is larger than the cycle of ridges and recesseswhich appears at a part where the first surface side of the basematerial overlaps the bellows-like member.
 17. The stretchable circuitsubstrate according to claim 16 wherein the cycle of ridges and recesseswhich appears at a part where the second surface positioned at anopposite side to the first surface side of the base material overlapsthe bellows-like member, is 1.1 times or more of the cycle of ridges andrecesses which appears at a part where the first surface side of thebase material overlaps the bellows-like member.
 18. The stretchablecircuit substrate according to claim 1, wherein a position of ridges andrecesses which appears at a part where a second surface positioned at anopposite side to the first surface side of the base material overlapsthe bellows-like member, is out of a position of ridges and recesseswhich appears at a part where the first surface side of the basematerial overlaps the bellows-like member.
 19. The stretchable circuitsubstrate according to claim 1, wherein, when F3 designates a cycle ofridges and recesses which appears at a part where the first surface sideof the base material overlaps the bellows-like member, a position ofridges and recesses which appears at a part where a second surfacepositioned at an opposite side to the first surface side of the basematerial overlaps the bellows-like member is 0.1* F3 or more out of theposition of ridges and recesses which appears at a part where the firstsurface side of the base material overlaps the bellows-like member. 20.The stretchable circuit substrate according to claim 1, wherein thestretchable circuit substrate comprises the wiring region and afunctional member region which is adjacent to the wiring region and onwhich a functional member is mounted; and a thickness of the adjustmentlayer, at least partly, decreases along a direction from the functionalmember region to the wiring region.
 21. An article comprising thestretchable circuit substrate according to claim
 1. 22. A stretchablecircuit substrate comprising: a base material being stretchable; awiring which is on a first surface side of the base material, and whichincludes a bellows-like member including a plurality of ridges andrecesses arranged in a first direction which is one of in-planedirections in the first surface side of the base material; and anadjustment layer which includes the bellows-like member and is on thefirst surface side of the base material so as to at least overlap, in aplan view, a wiring region in which the wiring is positioned; wherein:the adjustment layer has a Young's modulus larger than a Young's modulusof the base material; and ridges and recesses are included at a partwhere a second surface positioned at an opposite side to the firstsurface side of the base material overlaps the bellows-like member.